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John C. Gentile
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Austin, TX, US
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last 30 patents
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Patent Grant
Process for underfilling a flip-chip semiconductor device
Patent number
5,710,071
Issue date
Jan 20, 1998
Motorola, Inc.
Stanley C. Beddingfield
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Tab semiconductor device having die edge protection and method for...
Patent number
5,583,370
Issue date
Dec 10, 1996
Motorola Inc.
Leo M. Higgins
H01 - BASIC ELECTRIC ELEMENTS