John C. Milliken

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Patterson, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Surface mount chip package having an array of solder ball contacts...
- Patent number 5,490,040
- Issue date Feb 6, 1996
- International Business Machines Corporation
- Gene J. Gaudenzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and test method
- Patent number 5,147,084
- Issue date Sep 15, 1992
- International Business Machines Corporation
- John R. Behun
- G01 - MEASURING TESTING
Information Patent Grant
Interconnection structure and test method
- Patent number 5,060,844
- Issue date Oct 29, 1991
- International Business Machines Corporation
- John R. Behun
- G01 - MEASURING TESTING