John Charles Ehmke

Person

Garland, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vertical shear weld wafer bonding
- Patent number 11,858,806
- Issue date Jan 2, 2024
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dark mirror thin films
- Patent number 11,835,739
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- John Charles Ehmke
- G02 - OPTICS
Information Patent Grant
Selective wafer removal process for wafer bonding applications
- Patent number 11,167,983
- Issue date Nov 9, 2021
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through-substrate conductor support
- Patent number 11,084,717
- Issue date Aug 10, 2021
- Texas Instruments Incorporated
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stabilized transient liquid phase metal bonding material for hermet...
- Patent number 11,000,915
- Issue date May 11, 2021
- Texas Instruments Incorporated
- John Charles Ehmke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic vertical shear weld wafer bonding
- Patent number 10,759,658
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Transparent display panel cooling
- Patent number 10,750,645
- Issue date Aug 18, 2020
- Texas Instruments Incorported
- John Charles Ehmke
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 10,427,932
- Issue date Oct 1, 2019
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through-substrate conductor support
- Patent number 10,392,246
- Issue date Aug 27, 2019
- Texas Instruments Incorporated
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS electrostatic actuator device for RF varactor applications
- Patent number 9,966,194
- Issue date May 8, 2018
- Texas Instruments Incorporated
- Arun Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 9,890,036
- Issue date Feb 13, 2018
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Leak detection using cavity surface quality factor
- Patent number 9,796,585
- Issue date Oct 24, 2017
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically-sealed MEMS device and its fabrication
- Patent number 9,567,213
- Issue date Feb 14, 2017
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 9,140,898
- Issue date Sep 22, 2015
- Texas Instruments Incorporated
- John C. Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for packaging circuit devices
- Patent number 7,977,208
- Issue date Jul 12, 2011
- Raytheon Company
- Billy D. Ables
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for packaging circuit devices
- Patent number 7,867,874
- Issue date Jan 11, 2011
- Raytheon Company
- Billy D. Ables
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for packaging circuit devices
- Patent number 7,535,093
- Issue date May 19, 2009
- Raytheon Company
- Billy D. Ables
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of fabrication
- Patent number 7,449,765
- Issue date Nov 11, 2008
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating a lid for a wafer level packaged optical MEM...
- Patent number 6,856,014
- Issue date Feb 15, 2005
- Texas Instruments Incorporated
- John C. Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Membrane for micro-electro-mechanical switch, and methods of making...
- Patent number 6,803,534
- Issue date Oct 12, 2004
- Raytheon Company
- Shea Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for switching high frequency signals
- Patent number 6,700,172
- Issue date Mar 2, 2004
- Raytheon Company
- John C. Ehmke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level interconnection
- Patent number 6,633,079
- Issue date Oct 14, 2003
- Raytheon Company
- James L. Cheever
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Water level interconnection
- Patent number 6,512,300
- Issue date Jan 28, 2003
- Raytheon Company
- James L. Cheever
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for increasing bandwidth of a stripline to slo...
- Patent number 6,501,431
- Issue date Dec 31, 2002
- Raytheon Company
- James McGlathery Irion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for switching high frequency signals
- Patent number 6,391,675
- Issue date May 21, 2002
- Raytheon Company
- John C. Ehmke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned bump bond infrared focal plane array architecture
- Patent number 6,359,290
- Issue date Mar 19, 2002
- Raytheon Company
- John C. Ehmke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate supported three-dimensional micro-coil
- Patent number 6,147,582
- Issue date Nov 14, 2000
- Raytheon Company
- Charles L. Goldsmith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned bump bond infrared focal plane array architecture
- Patent number 5,536,680
- Issue date Jul 16, 1996
- Texas Instruments Incorporated
- John C. Ehmke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared focal plane array with integral slot shield using spin-on...
- Patent number 5,298,733
- Issue date Mar 29, 1994
- Texas Instruments Incorporated
- John C. Ehmke
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICAL SHEAR WELD WAFER BONDING
- Publication number 20210371272
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DARK MIRROR THIN FILMS
- Publication number 20210255372
- Publication date Aug 19, 2021
- TEXAS INSTRUMENTS INCORPORATED
- John Charles EHMKE
- G02 - OPTICS
Information Patent Application
VERTICAL SHEAR WELD WAFER BONDING
- Publication number 20200391993
- Publication date Dec 17, 2020
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELECTIVE WAFER REMOVAL PROCESS FOR WAFER BONDING APPLICATIONS
- Publication number 20200223690
- Publication date Jul 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- John Charles EHMKE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TRANSPARENT DISPLAY PANEL COOLING
- Publication number 20200196481
- Publication date Jun 18, 2020
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B60 - VEHICLES IN GENERAL
Information Patent Application
HERMETIC VERTICAL SHEAR WELD WAFER BONDING
- Publication number 20200180946
- Publication date Jun 11, 2020
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH-SUBSTRATE CONDUCTOR SUPPORT
- Publication number 20190382262
- Publication date Dec 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH-SUBSTRATE CONDUCTOR SUPPORT
- Publication number 20180186629
- Publication date Jul 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED MEMS DEVICE AND ITS FABRICATION
- Publication number 20180148319
- Publication date May 31, 2018
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STABILIZED TRANSIENT LIQUID PHASE METAL BONDING MATERIAL FOR HERMET...
- Publication number 20170283255
- Publication date Oct 5, 2017
- TEXAS INSTRUMENTS INCORPORATED
- John Charles EHMKE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEAK DETECTION USING CAVITY SURFACE QUALITY FACTOR
- Publication number 20170174511
- Publication date Jun 22, 2017
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED MEMS DEVICE AND ITS FABRICATION
- Publication number 20170152136
- Publication date Jun 1, 2017
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ELECTROSTATIC ACTUATOR DEVICE FOR RF VARACTOR APPLICATIONS
- Publication number 20170098509
- Publication date Apr 6, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Arun Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY-SEALED MEMS DEVICE AND ITS FABRICATION
- Publication number 20170050844
- Publication date Feb 23, 2017
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ELECTROSTATIC ACTUATOR DEVICE FOR RF VARACTOR APPLICATIONS
- Publication number 20160176701
- Publication date Jun 23, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Arun Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED MEMS DEVICE AND ITS FABRICATION
- Publication number 20140268295
- Publication date Sep 18, 2014
- John C. Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Apparatus for Packaging Circuit Devices
- Publication number 20110097845
- Publication date Apr 28, 2011
- Raytheon Company
- Billy D. Ables
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Apparatus for Packaging Circuit Devices
- Publication number 20090227068
- Publication date Sep 10, 2009
- Raytheon Company
- Billy D. Ables
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method of fabrication
- Publication number 20070200222
- Publication date Aug 30, 2007
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for adhesive bonding in electronic packaging
- Publication number 20060243384
- Publication date Nov 2, 2006
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level interconnection
- Publication number 20030047799
- Publication date Mar 13, 2003
- Raytheon Company
- James L. Cheever
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL INTERCONNECTION
- Publication number 20030001251
- Publication date Jan 2, 2003
- James L. Cheever
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and apparatus for switching high frequency signals
- Publication number 20020036304
- Publication date Mar 28, 2002
- Raytheon Company, a Delaware corporation
- John C. Ehmke
- H01 - BASIC ELECTRIC ELEMENTS

John Charles Ehmke

Person

Patents Grantslast 30 patents

Vertical shear weld wafer bonding

Dark mirror thin films

Selective wafer removal process for wafer bonding applications

Through-substrate conductor support

Stabilized transient liquid phase metal bonding material for hermet...

Hermetic vertical shear weld wafer bonding

Transparent display panel cooling

Hermetically sealed MEMS device and its fabrication

Through-substrate conductor support

MEMS electrostatic actuator device for RF varactor applications

Hermetically sealed MEMS device and its fabrication

Leak detection using cavity surface quality factor

Hermetically-sealed MEMS device and its fabrication

Hermetically sealed MEMS device and its fabrication

Method and apparatus for packaging circuit devices

Method and apparatus for packaging circuit devices

Method and apparatus for packaging circuit devices

Semiconductor device and method of fabrication

Method for fabricating a lid for a wafer level packaged optical MEM...

Membrane for micro-electro-mechanical switch, and methods of making...

Method and apparatus for switching high frequency signals

Wafer level interconnection

Water level interconnection

Method and apparatus for increasing bandwidth of a stripline to slo...

Method and apparatus for switching high frequency signals

Self-aligned bump bond infrared focal plane array architecture

Substrate supported three-dimensional micro-coil

Self-aligned bump bond infrared focal plane array architecture

Infrared focal plane array with integral slot shield using spin-on...

Patents Applicationslast 30 patents

VERTICAL SHEAR WELD WAFER BONDING

DARK MIRROR THIN FILMS

VERTICAL SHEAR WELD WAFER BONDING

SELECTIVE WAFER REMOVAL PROCESS FOR WAFER BONDING APPLICATIONS

TRANSPARENT DISPLAY PANEL COOLING

HERMETIC VERTICAL SHEAR WELD WAFER BONDING

THROUGH-SUBSTRATE CONDUCTOR SUPPORT

THROUGH-SUBSTRATE CONDUCTOR SUPPORT

HERMETICALLY SEALED MEMS DEVICE AND ITS FABRICATION

STABILIZED TRANSIENT LIQUID PHASE METAL BONDING MATERIAL FOR HERMET...

LEAK DETECTION USING CAVITY SURFACE QUALITY FACTOR

HERMETICALLY SEALED MEMS DEVICE AND ITS FABRICATION

MEMS ELECTROSTATIC ACTUATOR DEVICE FOR RF VARACTOR APPLICATIONS

HERMETICALLY-SEALED MEMS DEVICE AND ITS FABRICATION

MEMS ELECTROSTATIC ACTUATOR DEVICE FOR RF VARACTOR APPLICATIONS

HERMETICALLY SEALED MEMS DEVICE AND ITS FABRICATION

Method and Apparatus for Packaging Circuit Devices

Method and Apparatus for Packaging Circuit Devices

Semiconductor device and method of fabrication

Method for adhesive bonding in electronic packaging

Wafer level interconnection

WAFER LEVEL INTERCONNECTION

Method and apparatus for switching high frequency signals