John Christopher Arnold

Person

North Chatham, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Subtractive patterning of interconnect structures
- Patent number 12,020,949
- Issue date Jun 25, 2024
- International Business Machines Corporation
- Dominik Metzler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Placing top vias at line ends by selective growth of via mask from...
- Patent number 11,830,807
- Issue date Nov 28, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spin on scaffold film for forming topvia
- Patent number 11,688,636
- Issue date Jun 27, 2023
- International Business Machines Corporation
- Somnath Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding magneto-resistive random-access memory devices between me...
- Patent number 11,462,583
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device including self-aligne...
- Patent number 11,404,317
- Issue date Aug 2, 2022
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective gas etching for self-aligned pattern transfer
- Patent number 11,302,533
- Issue date Apr 12, 2022
- Tessera, Inc.
- John Christopher Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective patterning of vias with hardmasks
- Patent number 11,276,607
- Issue date Mar 15, 2022
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Litho-etch-litho-etch with self-aligned blocks
- Patent number 11,239,077
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line compatible processing for forming an array of pillars
- Patent number 11,195,995
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded MRAM device formation with self-aligned dielectric cap
- Patent number 11,189,783
- Issue date Nov 30, 2021
- International Business Machines Corporation
- John Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive RIE interconnect
- Patent number 11,189,528
- Issue date Nov 30, 2021
- International Business Machines Corporation
- John Christopher Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned top vias over metal lines formed by a damascene process
- Patent number 11,189,527
- Issue date Nov 30, 2021
- International Business Machines Corporation
- Timothy Mathew Philip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placing top vias at line ends by selective growth of via mask from...
- Patent number 11,189,561
- Issue date Nov 30, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating hardmasks for tight-pitch line formation
- Patent number 11,171,002
- Issue date Nov 9, 2021
- Tessera, Inc.
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM device formation with controlled ion beam etch of MTJ
- Patent number 11,158,786
- Issue date Oct 26, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned top via formation at line ends
- Patent number 11,152,261
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned top via
- Patent number 11,133,260
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer encapsulation to enable endpoint-based process control...
- Patent number 10,957,850
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective gas etching for self-aligned pattern transfer
- Patent number 10,930,504
- Issue date Feb 23, 2021
- Tessera, Inc.
- John Christopher Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extreme ultraviolet lithography for high volume manufacture of a se...
- Patent number 10,879,068
- Issue date Dec 29, 2020
- International Business Machines Corporation
- Yongan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM device formation with in-situ encapsulation
- Patent number 10,833,258
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of embedded magnetic random-access memory devices with mu...
- Patent number 10,833,257
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded etch rate reference layer for enhanced etch time precision
- Patent number 10,748,823
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer hardmask for high performance MRAM devices
- Patent number 10,714,683
- Issue date Jul 14, 2020
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of embedded magnetic random-access memory devices
- Patent number 10,707,413
- Issue date Jul 7, 2020
- International Business Machines Corporation
- Ashim Dutta
- G11 - INFORMATION STORAGE
Information Patent Grant
Lithographic alignment of a conductive line to a via
- Patent number 10,685,879
- Issue date Jun 16, 2020
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer hardmask for high performance MRAM devices
- Patent number 10,680,169
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating hardmasks for tight-pitch line formation
- Patent number 10,580,652
- Issue date Mar 3, 2020
- Tessera, Inc.
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective gas etching for self-aligned pattern transfer
- Patent number 10,559,467
- Issue date Feb 11, 2020
- International Business Machines Coporation
- John Christopher Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming field effect transistor (FET) circuits, and formi...
- Patent number 10,304,692
- Issue date May 28, 2019
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE SELF-ALIGNED POWER VIA SHAPE WITH GATE CUT FIRST
- Publication number 20240321957
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Eric Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE METAL VIA WITH METAL BRIDGE
- Publication number 20240282704
- Publication date Aug 22, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR A LOGIC DEVICE AND ANOTHER DEVICE
- Publication number 20230378258
- Publication date Nov 23, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-DIMENSIONAL SELF-ALIGNED BACKSIDE VIA-TO-BACKSIDE POWER RAIL (V...
- Publication number 20230215767
- Publication date Jul 6, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER RAILS AND POWER DISTRIBUTION NETWORK FOR DENSITY SCA...
- Publication number 20230207553
- Publication date Jun 29, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE PATTERNING OF INTERCONNECT STRUCTURES
- Publication number 20230084739
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Dominik Metzler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SPIN ON SCAFFOLD FILM FOR FORMING TOPVIA
- Publication number 20220406657
- Publication date Dec 22, 2022
- International Business Machines Corporation
- SOMNATH GHOSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE GAS ETCHING FOR SELF-ALIGNED PATTERN TRANSFER
- Publication number 20220262636
- Publication date Aug 18, 2022
- TESSERA LLC
- John Christopher Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PATTERNING OF VIAS WITH HARDMASKS
- Publication number 20220165612
- Publication date May 26, 2022
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLACING TOP VIAS AT LINE ENDS BY SELECTIVE GROWTH OF VIA MASK FROM...
- Publication number 20220028784
- Publication date Jan 27, 2022
- International Business Machines Corporation
- Ashim DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE RIE INTERCONNECT
- Publication number 20210335665
- Publication date Oct 28, 2021
- International Business Machines Corporation
- John Christopher Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED TOP VIAS OVER METAL LINES FORMED BY A DAMASCENE PROCESS
- Publication number 20210296169
- Publication date Sep 23, 2021
- International Business Machines Corporation
- Timothy Mathew Philip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Metal Contamination Removal from BEOL Wafers
- Publication number 20210296118
- Publication date Sep 23, 2021
- International Business Machines Corporation
- Devika Sil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE COMPATIBLE PROCESSING FOR FORMING AN ARRAY OF PILLARS
- Publication number 20210210679
- Publication date Jul 8, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE GAS ETCHING FOR SELF-ALIGNED PATTERN TRANSFER
- Publication number 20210183653
- Publication date Jun 17, 2021
- Tessera, Inc.
- John Christopher Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus For Reducing Wafer Contamination During ION-Beam Etching...
- Publication number 20210183627
- Publication date Jun 17, 2021
- International Business Machines Corporation
- John Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED TOP VIA
- Publication number 20210151377
- Publication date May 20, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHO-ETCH-LITHO-ETCH WITH SELF-ALIGNED BLOCKS
- Publication number 20210143013
- Publication date May 13, 2021
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING MAGNETO-RESISTIVE RANDOM-ACCESS MEMORY DEVICES BETWEEN ME...
- Publication number 20210134883
- Publication date May 6, 2021
- International Business Machines Corporation
- Ashim DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Top Via Formation at Line Ends
- Publication number 20210125865
- Publication date Apr 29, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MRAM DEVICE FORMATION WITH SELF-ALIGNED DIELECTRIC CAP
- Publication number 20210091301
- Publication date Mar 25, 2021
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- John Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled Ion Beam Etch of MTJ
- Publication number 20210091306
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED TOP VIA FORMATION AT LINE ENDS
- Publication number 20210090951
- Publication date Mar 25, 2021
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PATTERNING OF VIAS WITH HARDMASKS
- Publication number 20210082746
- Publication date Mar 18, 2021
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLACING TOP VIAS AT LINE ENDS BY SELECTIVE GROWTH OF VIA MASK FROM...
- Publication number 20210082807
- Publication date Mar 18, 2021
- International Business Machines Corporation
- Ashim DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE FORMATION WITH IN-SITU ENCAPSULATION
- Publication number 20200350495
- Publication date Nov 5, 2020
- International Business Machines Corporation
- Ashim Dutta
- G11 - INFORMATION STORAGE
Information Patent Application
FORMATION OF EMBEDDED MAGNETIC RANDOM-ACCESS MEMORY DEVICES WITH MU...
- Publication number 20200350494
- Publication date Nov 5, 2020
- International Business Machines Corporation
- Ashim Dutta
- G11 - INFORMATION STORAGE
Information Patent Application
ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION
- Publication number 20200266066
- Publication date Aug 20, 2020
- Tessera, Inc.
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER HARDMASK FOR HIGH PERFORMANCE MRAM DEVICES
- Publication number 20200144491
- Publication date May 7, 2020
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER ENCAPSULATION TO ENABLE ENDPOINT-BASED PROCESS CONTROL...
- Publication number 20200111951
- Publication date Apr 9, 2020
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS

John Christopher Arnold

Person

Patents Grantslast 30 patents

Subtractive patterning of interconnect structures

Placing top vias at line ends by selective growth of via mask from...

Spin on scaffold film for forming topvia

Embedding magneto-resistive random-access memory devices between me...

Method for fabricating a semiconductor device including self-aligne...

Selective gas etching for self-aligned pattern transfer

Selective patterning of vias with hardmasks

Litho-etch-litho-etch with self-aligned blocks

Back-end-of-line compatible processing for forming an array of pillars

Embedded MRAM device formation with self-aligned dielectric cap

Subtractive RIE interconnect

Self-aligned top vias over metal lines formed by a damascene process

Placing top vias at line ends by selective growth of via mask from...

Alternating hardmasks for tight-pitch line formation

MRAM device formation with controlled ion beam etch of MTJ

Self-aligned top via formation at line ends

Self-aligned top via

Multi-layer encapsulation to enable endpoint-based process control...

Selective gas etching for self-aligned pattern transfer

Extreme ultraviolet lithography for high volume manufacture of a se...

MRAM device formation with in-situ encapsulation

Formation of embedded magnetic random-access memory devices with mu...

Embedded etch rate reference layer for enhanced etch time precision

Multilayer hardmask for high performance MRAM devices

Formation of embedded magnetic random-access memory devices

Lithographic alignment of a conductive line to a via

Multilayer hardmask for high performance MRAM devices

Alternating hardmasks for tight-pitch line formation

Selective gas etching for self-aligned pattern transfer

Method of forming field effect transistor (FET) circuits, and formi...

Patents Applicationslast 30 patents

FLEXIBLE SELF-ALIGNED POWER VIA SHAPE WITH GATE CUT FIRST

SUBTRACTIVE METAL VIA WITH METAL BRIDGE

METHOD AND STRUCTURE FOR A LOGIC DEVICE AND ANOTHER DEVICE

TWO-DIMENSIONAL SELF-ALIGNED BACKSIDE VIA-TO-BACKSIDE POWER RAIL (V...

BACKSIDE POWER RAILS AND POWER DISTRIBUTION NETWORK FOR DENSITY SCA...

SUBTRACTIVE PATTERNING OF INTERCONNECT STRUCTURES

SPIN ON SCAFFOLD FILM FOR FORMING TOPVIA

SELECTIVE GAS ETCHING FOR SELF-ALIGNED PATTERN TRANSFER

SELECTIVE PATTERNING OF VIAS WITH HARDMASKS

PLACING TOP VIAS AT LINE ENDS BY SELECTIVE GROWTH OF VIA MASK FROM...

SUBTRACTIVE RIE INTERCONNECT

SELF-ALIGNED TOP VIAS OVER METAL LINES FORMED BY A DAMASCENE PROCESS

Embedded Metal Contamination Removal from BEOL Wafers

BACK-END-OF-LINE COMPATIBLE PROCESSING FOR FORMING AN ARRAY OF PILLARS

SELECTIVE GAS ETCHING FOR SELF-ALIGNED PATTERN TRANSFER

Apparatus For Reducing Wafer Contamination During ION-Beam Etching...

SELF-ALIGNED TOP VIA

LITHO-ETCH-LITHO-ETCH WITH SELF-ALIGNED BLOCKS

EMBEDDING MAGNETO-RESISTIVE RANDOM-ACCESS MEMORY DEVICES BETWEEN ME...

Self-Aligned Top Via Formation at Line Ends

EMBEDDED MRAM DEVICE FORMATION WITH SELF-ALIGNED DIELECTRIC CAP

Controlled Ion Beam Etch of MTJ

SELF-ALIGNED TOP VIA FORMATION AT LINE ENDS

SELECTIVE PATTERNING OF VIAS WITH HARDMASKS

PLACING TOP VIAS AT LINE ENDS BY SELECTIVE GROWTH OF VIA MASK FROM...

MRAM DEVICE FORMATION WITH IN-SITU ENCAPSULATION

FORMATION OF EMBEDDED MAGNETIC RANDOM-ACCESS MEMORY DEVICES WITH MU...

ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION

MULTILAYER HARDMASK FOR HIGH PERFORMANCE MRAM DEVICES

MULTI-LAYER ENCAPSULATION TO ENABLE ENDPOINT-BASED PROCESS CONTROL...