John Commander

Person

Old Saybrook, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper deposition in wafer level packaging of integrated circuits
- Patent number 11,697,884
- Issue date Jul 11, 2023
- MacDermid Enthone Inc.
- Thomas Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cobalt filling of interconnects in microelectronics
- Patent number 11,434,578
- Issue date Sep 6, 2022
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cobalt filling of interconnects
- Patent number 11,401,618
- Issue date Aug 2, 2022
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper deposition in wafer level packaging of integrated circuits
- Patent number 11,124,888
- Issue date Sep 21, 2021
- MacDermid Enthone Inc.
- Thomas Richardson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Cobalt filling of interconnects
- Patent number 11,035,048
- Issue date Jun 15, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cobalt filling of interconnects in microelectronics
- Patent number 10,995,417
- Issue date May 4, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Defect reduction in electrodeposited copper for semiconductor appli...
- Patent number 9,222,188
- Issue date Dec 29, 2015
- Enthone Inc.
- John Commander
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Defect reduction in electrodeposited copper for semiconductor appli...
- Patent number 7,316,772
- Issue date Jan 8, 2008
- Enthone Inc.
- John Commander
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating process for electroless nickel on zinc die castings
- Patent number 5,578,187
- Issue date Nov 26, 1996
- Enthone-OMI, Inc.
- Mark W. Zitko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Alkaline zinc and zinc alloy electroplating baths and processes
- Patent number 5,435,898
- Issue date Jul 25, 1995
- Enthone-OMI Inc.
- John H. Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Bright tin electrodeposition composition
- Patent number 5,061,351
- Issue date Oct 29, 1991
- Enthone-OMI, Inc.
- John H. Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20240018678
- Publication date Jan 18, 2024
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Deposition in Wafer Level Packaging of Integrated Circuits
- Publication number 20210388519
- Publication date Dec 16, 2021
- MacDermid Enthone Inc.
- Thomas Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cobalt Filling of Interconnects
- Publication number 20210332491
- Publication date Oct 28, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cobalt Filling of Interconnects in Microelectronics
- Publication number 20210222314
- Publication date Jul 22, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cobalt Filling of Interconnects in Microelectronics
- Publication number 20200040478
- Publication date Feb 6, 2020
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20190390356
- Publication date Dec 26, 2019
- MacDermid Enthone Inc.
- Vincent Paneccasio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Deposition in Wafer Level Packaging of Integrated Circuits
- Publication number 20190368064
- Publication date Dec 5, 2019
- MacDermid Enthone Inc.
- Thomas Richardson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Cobalt Filling of Interconnects
- Publication number 20190010624
- Publication date Jan 10, 2019
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR METALIZATION OF COPPER PILLARS IN THE MANUFACTURE OF MI...
- Publication number 20180355502
- Publication date Dec 13, 2018
- MacDermid Enthone Inc.
- Elie Najjar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrodeposition of Copper
- Publication number 20160281251
- Publication date Sep 29, 2016
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEFECT REDUCTION IN ELECTRODEPOSITED COPPER FOR SEMICONDUCTOR APPLI...
- Publication number 20080121527
- Publication date May 29, 2008
- Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Defect reduction in electrodeposited copper for semiconductor appli...
- Publication number 20030168343
- Publication date Sep 11, 2003
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

John Commander

Person

Patents Grantslast 30 patents

Copper deposition in wafer level packaging of integrated circuits

Cobalt filling of interconnects in microelectronics

Cobalt filling of interconnects

Copper deposition in wafer level packaging of integrated circuits

Cobalt filling of interconnects

Cobalt filling of interconnects in microelectronics

Defect reduction in electrodeposited copper for semiconductor appli...

Defect reduction in electrodeposited copper for semiconductor appli...

Plating process for electroless nickel on zinc die castings

Alkaline zinc and zinc alloy electroplating baths and processes

Bright tin electrodeposition composition

Patents Applicationslast 30 patents

Copper Electrodeposition in Microelectronics

Copper Deposition in Wafer Level Packaging of Integrated Circuits

Cobalt Filling of Interconnects

Cobalt Filling of Interconnects in Microelectronics

Cobalt Filling of Interconnects in Microelectronics

Copper Electrodeposition in Microelectronics

Copper Deposition in Wafer Level Packaging of Integrated Circuits

Cobalt Filling of Interconnects

PROCESS FOR METALIZATION OF COPPER PILLARS IN THE MANUFACTURE OF MI...

Electrodeposition of Copper

DEFECT REDUCTION IN ELECTRODEPOSITED COPPER FOR SEMICONDUCTOR APPLI...

Defect reduction in electrodeposited copper for semiconductor appli...