John D. Larnerd

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Owego, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of additive circuitization of circuit boards with high adhes...
- Patent number 5,166,037
- Issue date Nov 24, 1992
- International Business Machines Corporation
- John M. Atkinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder leveling technique
- Patent number 4,676,426
- Issue date Jun 30, 1987
- IBM Corp.
- Russell E. Darrow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for connecting contact pins to a substrate
- Patent number 4,550,493
- Issue date Nov 5, 1985
- International Business Machines Corporation
- Russell E. Darrow
- H01 - BASIC ELECTRIC ELEMENTS