John DECKER

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronics package comprising a package-on-package (PoP) arch...
- Patent number 12,347,743
- Issue date Jul 1, 2025
- Intel Corporation
- Elizabeth Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package comprising a package-on-package (POP) arch...
- Patent number 12,315,777
- Issue date May 27, 2025
- Intel Corporation
- Elizabeth Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal conductivity, high modulus structure within a mold mat...
- Patent number 11,749,585
- Issue date Sep 5, 2023
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trenches in wafer level packages for improvements in warpage reliab...
- Patent number 11,688,634
- Issue date Jun 27, 2023
- Intel Corporation
- Vipul Mehta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PAC...
- Publication number 20240321807
- Publication date Sep 26, 2024
- Intel Corporation
- Jonas CROISSANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240128152
- Publication date Apr 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240021493
- Publication date Jan 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240014097
- Publication date Jan 11, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL CONDUCTIVITY, HIGH MODULUS STRUCTURE WITHIN A MOLD MAT...
- Publication number 20210272878
- Publication date Sep 2, 2021
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20210066155
- Publication date Mar 4, 2021
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCHES IN WAFER LEVEL PACKAGES FOR IMPROVEMENTS IN WARPAGE RELIAB...
- Publication number 20210035859
- Publication date Feb 4, 2021
- Intel Corporation
- Vipul MEHTA
- H01 - BASIC ELECTRIC ELEMENTS

John DECKER

Person

Patents Grantslast 30 patents

Microelectronics package comprising a package-on-package (PoP) arch...

Microelectronics package comprising a package-on-package (POP) arch...

High thermal conductivity, high modulus structure within a mold mat...

Trenches in wafer level packages for improvements in warpage reliab...

Patents Applicationslast 30 patents

BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PAC...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

HIGH THERMAL CONDUCTIVITY, HIGH MODULUS STRUCTURE WITHIN A MOLD MAT...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

TRENCHES IN WAFER LEVEL PACKAGES FOR IMPROVEMENTS IN WARPAGE RELIAB...