John Ditri

Person

Huntingdon Valley, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultrasound horn
- Patent number 11,691,214
- Issue date Jul 4, 2023
- Shinkawa Ltd.
- Hiroshi Munakata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-phase fluid-actuated cooling device, system, and method
- Patent number 10,602,635
- Issue date Mar 24, 2020
- Lockheed Martin Corporation
- John Ditri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro jet impingement heat sink
- Patent number 10,306,802
- Issue date May 28, 2019
- Lockheed Martin Corporation
- John Ditri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integration of chip level micro-fluidic cooling in chip packages fo...
- Patent number 10,211,127
- Issue date Feb 19, 2019
- Lockheed Martin Corporation
- Daniel W. Harris
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Solar heat collecting element having an edge welded bellows assembly
- Patent number 9,719,694
- Issue date Aug 1, 2017
- Lockheed Martin Corporation
- David Velasco
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Integration of chip level micro-fluidic cooling in chip packages fo...
- Patent number 9,659,838
- Issue date May 23, 2017
- Lockheed Martin Corporation
- Daniel W. Harris
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Solar heat collecting element having an edge welded bellows assembly
- Patent number 9,423,154
- Issue date Aug 23, 2016
- Lockheed Martin Corporation
- David Velasco
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Integrated-circuit amplifier with low temperature rise
- Patent number 8,963,645
- Issue date Feb 24, 2015
- Lockheed Martin Corporation
- David R. Helms
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Solar receiver diaphragm
- Patent number 8,881,721
- Issue date Nov 11, 2014
- Lockheed Martin Corporation
- John J. Morber
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Fluid actuated cooling card retainer
- Patent number 8,780,556
- Issue date Jul 15, 2014
- Lochheed Martin Corporation
- John Ditri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated-circuit amplifier with low temperature rise
- Patent number 8,466,747
- Issue date Jun 18, 2013
- Lockheed Martin Corporation
- David R. Helms
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Robust glass to metal sealing joint
- Patent number 8,302,596
- Issue date Nov 6, 2012
- Lockheed Martin Corporation
- David Velasco
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Indirect imaging method for a bonding tool
- Patent number 6,712,257
- Issue date Mar 30, 2004
- Kulicke & Soffa Investments, Inc.
- David T. Beatson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Indirect imaging system for a bonding tool
- Patent number 6,641,026
- Issue date Nov 4, 2003
- Kulicke & Soffa Investments, Inc.
- David T. Beatson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire tensioning apparatus
- Patent number 6,520,400
- Issue date Feb 18, 2003
- Kulicke & Soffa Investments, Inc.
- John Ditri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cornercube offset tool
- Patent number 6,412,683
- Issue date Jul 2, 2002
- Kulicke & Soffa Investments, Inc.
- David T. Beatson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ULTRASOUND HORN
- Publication number 20230125043
- Publication date Apr 20, 2023
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE FLUID-ACTUATED COOLING DEVICE, SYSTEM, AND METHOD
- Publication number 20190230808
- Publication date Jul 25, 2019
- Lockheed Martin Corporation
- John Ditri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATION OF CHIP LEVEL MICRO-FLUIDIC COOLING IN CHIP PACKAGES FO...
- Publication number 20190181071
- Publication date Jun 13, 2019
- Lockheed Martin Corporation
- Daniel W. Harris
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SOLAR RECEIVER DIAPHRAGM
- Publication number 20130000633
- Publication date Jan 3, 2013
- John J. Morber
- F24 - HEATING RANGES VENTILATING
Information Patent Application
Die attach process using cornercube offset tool
- Publication number 20040012784
- Publication date Jan 22, 2004
- David T. Beatson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Indirect imaging system for a bonding tool
- Publication number 20030019908
- Publication date Jan 30, 2003
- David T. Beatson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Indirect imaging method for a bonding tool
- Publication number 20030019911
- Publication date Jan 30, 2003
- David T. Beatson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire tensioning apparatus
- Publication number 20020139830
- Publication date Oct 3, 2002
- Kulicke & Soffa Investment, Inc.
- John Ditri
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Ultrasound horn

Two-phase fluid-actuated cooling device, system, and method

Micro jet impingement heat sink

Integration of chip level micro-fluidic cooling in chip packages fo...

Solar heat collecting element having an edge welded bellows assembly

Integration of chip level micro-fluidic cooling in chip packages fo...

Solar heat collecting element having an edge welded bellows assembly

Integrated-circuit amplifier with low temperature rise

Solar receiver diaphragm

Fluid actuated cooling card retainer

Integrated-circuit amplifier with low temperature rise

Robust glass to metal sealing joint

Indirect imaging method for a bonding tool

Indirect imaging system for a bonding tool

Wire tensioning apparatus

Cornercube offset tool

Patents Applicationslast 30 patents

ULTRASOUND HORN

TWO-PHASE FLUID-ACTUATED COOLING DEVICE, SYSTEM, AND METHOD

INTEGRATION OF CHIP LEVEL MICRO-FLUIDIC COOLING IN CHIP PACKAGES FO...

SOLAR RECEIVER DIAPHRAGM

Die attach process using cornercube offset tool

Indirect imaging system for a bonding tool

Indirect imaging method for a bonding tool

Wire tensioning apparatus