John Ducyao BELERAN

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods for forming semiconductor package
- Patent number 10,381,280
- Issue date Aug 13, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packages and methods for forming semiconductor package
- Patent number 9,613,877
- Issue date Apr 4, 2017
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE
- Publication number 20170294401
- Publication date Oct 12, 2017
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE
- Publication number 20150102478
- Publication date Apr 16, 2015
- United Test & Assembly Center Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS