John E. Campbell

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
IC with 3D metal-insulator-metal capacitor
- Patent number 11,710,764
- Issue date Jul 25, 2023
- Texas Instruments Incorporated
- Poornika Fernandes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High precision capacitor dielectric
- Patent number 9,496,327
- Issue date Nov 15, 2016
- Texas Instruments Incorporated
- John Paul Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High precision capacitor dielectric
- Patent number 9,281,213
- Issue date Mar 8, 2016
- Texas Instruments Incorporated
- John Paul Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance stacked annular contact
- Patent number 9,035,458
- Issue date May 19, 2015
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of precision MIM capacitor and precision thin film resi...
- Patent number 8,754,501
- Issue date Jun 17, 2014
- Texas Instruments Incorporated
- Imran Mahmood Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance stacked annular contact
- Patent number 8,652,855
- Issue date Feb 18, 2014
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for removing contaminants from aluminum-comprising bond pad...
- Patent number 8,236,703
- Issue date Aug 7, 2012
- Texas Instruments Incorporated
- Alfred J. Griffin, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffer layer for ferroelectric random access memory
- Patent number 8,071,430
- Issue date Dec 6, 2011
- Texas Instruments Incorporated
- Scott R. Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffer layer for ferroelectric random access memory
- Patent number 8,058,677
- Issue date Nov 15, 2011
- Texas Instruments Incorporated
- Scott R. Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a void free via
- Patent number 7,323,409
- Issue date Jan 29, 2008
- Texas Instruments Incorporated
- Alfred J. Griffin, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a void free via
- Patent number 6,977,437
- Issue date Dec 20, 2005
- Texas Instruments Incorporated
- Alfred J. Griffin, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shallow trench isolation planarization using self aligned isotropic...
- Patent number 6,686,283
- Issue date Feb 3, 2004
- Texas Instruments Incorporated
- Shawn T. Walsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for trench isolation of semiconductor devices
- Patent number 6,228,741
- Issue date May 8, 2001
- Texas Instruments Incorporated
- Shawn T. Walsh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IC WITH 3D METAL-INSULATOR-METAL CAPACITOR
- Publication number 20200006471
- Publication date Jan 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- POORNIKA FERNANDES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR INTEGRATION IN COPPER DAMASCENE METALLIZATION
- Publication number 20160218062
- Publication date Jul 28, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Rajni J. Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRECISION CAPACITOR DIELECTRIC
- Publication number 20160163782
- Publication date Jun 9, 2016
- TEXAS INSTRUMENTS INCORPORATED
- John Paul CAMPBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRECISION CAPACITOR DIELECTRIC
- Publication number 20150187598
- Publication date Jul 2, 2015
- TEXAS INSTRUMENTS INCORPORATED
- John Paul CAMPBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE STACKED ANNULAR CONTACT
- Publication number 20140131781
- Publication date May 15, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration of Precision MIM Capacitor and Precision Thin Film Resi...
- Publication number 20130341759
- Publication date Dec 26, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Imran Mahmood Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING FERROELECTRIC MEMORY WITH DENSE VIA BARRIER
- Publication number 20130264620
- Publication date Oct 10, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Zhiyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE STACKED ANNULAR CONTACT
- Publication number 20130082314
- Publication date Apr 4, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Buffer Layer for Ferroelectric Random Access Memory
- Publication number 20110183471
- Publication date Jul 28, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Scott R. Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Buffer Layer for Ferroelectric Random Access Memory
- Publication number 20090321964
- Publication date Dec 31, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Scott R. Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REMOVING CONTAMINANTS FROM ALUMINUM-COMPRISING BOND PAD...
- Publication number 20090068847
- Publication date Mar 12, 2009
- Texas Instruments Inc.
- Alfred J. Griffin, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FABRICATING AN INTEGRATED CIRCUIT
- Publication number 20080207006
- Publication date Aug 28, 2008
- James Scott Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for reducing integrated circuit defects
- Publication number 20050239289
- Publication date Oct 27, 2005
- Nilesh S. Doke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a void free via
- Publication number 20050146035
- Publication date Jul 7, 2005
- Alfred J. Griffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for reducing integrated circuit defects
- Publication number 20040266185
- Publication date Dec 30, 2004
- TEXAS INSTRUMENTS INCORPORATED
- Nilesh S. Doke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a void free via
- Publication number 20040178504
- Publication date Sep 16, 2004
- Alfred J. Griffin
- H01 - BASIC ELECTRIC ELEMENTS

John E. Campbell

Person

Patents Grantslast 30 patents

IC with 3D metal-insulator-metal capacitor

High precision capacitor dielectric

High precision capacitor dielectric

Low resistance stacked annular contact

Integration of precision MIM capacitor and precision thin film resi...

Low resistance stacked annular contact

Methods for removing contaminants from aluminum-comprising bond pad...

Stress buffer layer for ferroelectric random access memory

Stress buffer layer for ferroelectric random access memory

Method for forming a void free via

Method for forming a void free via

Shallow trench isolation planarization using self aligned isotropic...

Method for trench isolation of semiconductor devices

Patents Applicationslast 30 patents

IC WITH 3D METAL-INSULATOR-METAL CAPACITOR

THIN FILM RESISTOR INTEGRATION IN COPPER DAMASCENE METALLIZATION

HIGH PRECISION CAPACITOR DIELECTRIC

HIGH PRECISION CAPACITOR DIELECTRIC

LOW RESISTANCE STACKED ANNULAR CONTACT

Integration of Precision MIM Capacitor and Precision Thin Film Resi...

INTEGRATED CIRCUIT HAVING FERROELECTRIC MEMORY WITH DENSE VIA BARRIER

LOW RESISTANCE STACKED ANNULAR CONTACT

Stress Buffer Layer for Ferroelectric Random Access Memory

Stress Buffer Layer for Ferroelectric Random Access Memory

METHODS FOR REMOVING CONTAMINANTS FROM ALUMINUM-COMPRISING BOND PAD...

PROCESS FOR FABRICATING AN INTEGRATED CIRCUIT

Method for reducing integrated circuit defects

Method for forming a void free via

Method for reducing integrated circuit defects

Method for forming a void free via