John E. Heidenreich, III

Follow

Person

Yorktown Heights, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper to aluminum interlayer interconnect using stud and via liner
- Patent number 7,087,997
- Issue date Aug 8, 2006
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper to aluminum interlayer interconnect using stud and via liner
- Patent number 7,037,824
- Issue date May 2, 2006
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS