John E. McConnell

Person

Simpsonville, SC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming an electronic device
- Patent number 11,432,448
- Issue date Aug 30, 2022
- KEMET Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless multi-layered ceramic capacitor stack
- Patent number 11,227,719
- Issue date Jan 18, 2022
- KEMET Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component structures with reduced microphonic noise
- Patent number 10,984,955
- Issue date Apr 20, 2021
- KEMET Electronics Corporation
- John Bultitude
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a leadless stack comprising multiple components
- Patent number 10,790,094
- Issue date Sep 29, 2020
- KEMET Electronics Corporation
- John E. McConnell
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
High density multi-component packages
- Patent number 10,757,810
- Issue date Aug 25, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component stability structure
- Patent number 10,729,051
- Issue date Jul 28, 2020
- KEMET Electronics Corporation
- John E. McConnell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density multi-component packages
- Patent number 10,707,145
- Issue date Jul 7, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density multi-component packages
- Patent number 10,681,814
- Issue date Jun 9, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless stack comprising multiple components
- Patent number 10,381,162
- Issue date Aug 13, 2019
- Kemet Electronics Corporation
- John E. McConnell
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic component structures with reduced microphonic noise
- Patent number 10,366,836
- Issue date Jul 30, 2019
- Kemet Electronics Corporation
- John Bultitude
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered ceramic capacitor with soft leaded module
- Patent number 10,229,785
- Issue date Mar 12, 2019
- Kemet Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk MLCC capacitor module
- Patent number 10,224,149
- Issue date Mar 5, 2019
- Kemet Electronics Corporation
- Galen W. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadless multi-layered ceramic capacitor stacks
- Patent number 10,068,707
- Issue date Sep 4, 2018
- Kemet Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component termination and assembly by means of transient...
- Patent number 9,881,744
- Issue date Jan 30, 2018
- Kemet Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple MLCC modules
- Patent number 9,805,872
- Issue date Oct 31, 2017
- Kemet Electronics Corporation
- Galen W. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component termination and assembly by means of transient...
- Patent number 9,793,057
- Issue date Oct 17, 2017
- Kemet Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering of high temperature conductive and resistive pastes onto...
- Patent number 9,779,874
- Issue date Oct 3, 2017
- Kemet Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving electromechanical integrity of cathode coating...
- Patent number 9,748,043
- Issue date Aug 29, 2017
- Kemet Electronics Corporation
- Antony P. Chacko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless multi-layered ceramic capacitor stacks
- Patent number 9,472,342
- Issue date Oct 18, 2016
- KEMET Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coefficient of thermal expansion compensating compliant component
- Patent number 9,357,634
- Issue date May 31, 2016
- Kemet Electronics Corporation
- John E. McConnell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked leaded array
- Patent number 9,171,672
- Issue date Oct 27, 2015
- Kemet Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very large ceramic capacitor with mechanical shock resistance
- Patent number 9,025,311
- Issue date May 5, 2015
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio stacked MLCC design
- Patent number 8,988,857
- Issue date Mar 24, 2015
- Kemet Electronics Corporation
- John E. McConnell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of attaching an electronic device to an MLCC having a curved...
- Patent number 8,910,356
- Issue date Dec 16, 2014
- Kemet Electronics Corporation
- Michael S. Randall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Externally fused and resistively loaded safety capacitor
- Patent number 8,904,609
- Issue date Dec 9, 2014
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component termination and assembly by means of transient...
- Patent number 8,902,565
- Issue date Dec 2, 2014
- Kemet Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of improving electromechanical integrity of cathode coating...
- Patent number 8,896,986
- Issue date Nov 25, 2014
- Kemet Electronics Corporation
- Antony P. Chacko
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Leaded multi-layer ceramic capacitor with low ESL and low ESR
- Patent number 8,331,078
- Issue date Dec 11, 2012
- Kemet Electronics Corporation
- John E. McConnell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Externally fused and resistively loaded safety capacitor
- Patent number 8,264,816
- Issue date Sep 11, 2012
- Kemet Electronics Corporation
- John Bultitude
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of attaching an electronic device to an MLCC having a curved...
- Patent number 7,958,627
- Issue date Jun 14, 2011
- Kemet Electronics Corporation
- Michael S. Randall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Stable Power Modules By Thermoelectric Cooling
- Publication number 20230038175
- Publication date Feb 9, 2023
- KEMET Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Stability Structure
- Publication number 20200323112
- Publication date Oct 8, 2020
- KEMET Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless Stack Comprising Multiple Components
- Publication number 20190318877
- Publication date Oct 17, 2019
- Kemet Electronics Corporation
- John E. McConnell
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Electronic Component Structures with Reduced Microphonic Noise
- Publication number 20190304698
- Publication date Oct 3, 2019
- Kemet Electronics Corporation
- John Bultitude
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Density Multi-Component Packages
- Publication number 20190090348
- Publication date Mar 21, 2019
- Kemet Electronics Corporation
- John Bultitude
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Density Multi-Component Packages
- Publication number 20190080982
- Publication date Mar 14, 2019
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density Multi-Component Packages
- Publication number 20190082539
- Publication date Mar 14, 2019
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stable Power Capacitors by Thermoelectric Cooling
- Publication number 20180368293
- Publication date Dec 20, 2018
- Kemet Electronics Corporation
- JOHN BULTITUDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless Multi-Layered Ceramic Capacitor Stack
- Publication number 20180190430
- Publication date Jul 5, 2018
- Kemet Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Stability Structure
- Publication number 20170367228
- Publication date Dec 21, 2017
- Kemet Electronics Corporation
- John E. McConnell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Leadless Stack Comprising Multiple Components
- Publication number 20170358397
- Publication date Dec 14, 2017
- Kemet Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple MLCC Modules
- Publication number 20170169955
- Publication date Jun 15, 2017
- Kemet Electronics Corporation
- Galen W. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bulk MLCC Capacitor Module
- Publication number 20170169956
- Publication date Jun 15, 2017
- Kemet Electronics Corporation
- Galen W. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Structures with Reduced Microphonic Noise
- Publication number 20170025223
- Publication date Jan 26, 2017
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Termination and Assembly by Means of Transient...
- Publication number 20160254097
- Publication date Sep 1, 2016
- Kemet Electroncs Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless Multi-Layered Ceramic Capacitor Stacks
- Publication number 20160071650
- Publication date Mar 10, 2016
- Kemet Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Termination and Assembly by Means of Transient...
- Publication number 20140177132
- Publication date Jun 26, 2014
- Kemet Electronics Corporation
- JOHN E. MCCONNELL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Layered Ceramic Capacitor with Soft Leaded Module
- Publication number 20140160624
- Publication date Jun 12, 2014
- Kemet Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sintering of High Temperature Conductive and Resistive Pastes onto...
- Publication number 20140139971
- Publication date May 22, 2014
- Kemet Electronics Corporation
- John E. McConnell
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Leadless Multi-Layered Ceramic Capacitor Stacks
- Publication number 20140002952
- Publication date Jan 2, 2014
- Kemet Electrinics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Improving Electromechanical Integrity of Cathode Coating...
- Publication number 20130314845
- Publication date Nov 28, 2013
- Kemet Electronics Corporation
- Antony P. Chacko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COEFFICIENT OF THERMAL EXPANSION COMPENSATING COMPLIANT COMPONENT
- Publication number 20130284501
- Publication date Oct 31, 2013
- Kemet Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO STACKED MLCC DESIGN
- Publication number 20130146347
- Publication date Jun 13, 2013
- Kemet Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED LEADED ARRAY
- Publication number 20130016488
- Publication date Jan 17, 2013
- Kemet Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING OF HIGH TEMPERATURE CONDUCTIVE AND RESISTIVE PASTES ONTO...
- Publication number 20130010400
- Publication date Jan 10, 2013
- Kemet Electronics Corporation
- John E. McConnell
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
EXTERNALLY FUSED AND RESISTIVELY LOADED SAFETY CAPACITOR
- Publication number 20120079693
- Publication date Apr 5, 2012
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT...
- Publication number 20110292567
- Publication date Dec 1, 2011
- Kemet Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF IMPROVING ELECTROMECHANICAL INTEGRITY OF CATHODE COATING...
- Publication number 20110292572
- Publication date Dec 1, 2011
- Kemet Electronics Corporation
- Antony P. Chacko
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
EXTERNALLY FUSED AND RESISTIVELY LOADED SAFETY CAPACITOR
- Publication number 20110043963
- Publication date Feb 24, 2011
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED MULTI-LAYER CERAMIC CAPACITOR WITH LOW ESL AND LOW ESR
- Publication number 20100243307
- Publication date Sep 30, 2010
- John E. McConnell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

John E. McConnell

Person

Patents Grantslast 30 patents

Method of forming an electronic device

Leadless multi-layered ceramic capacitor stack

Electronic component structures with reduced microphonic noise

Method of forming a leadless stack comprising multiple components

High density multi-component packages

Component stability structure

High density multi-component packages

High density multi-component packages

Leadless stack comprising multiple components

Electronic component structures with reduced microphonic noise

Multi-layered ceramic capacitor with soft leaded module

Bulk MLCC capacitor module

Leadless multi-layered ceramic capacitor stacks

Electronic component termination and assembly by means of transient...

Multiple MLCC modules

Electronic component termination and assembly by means of transient...

Sintering of high temperature conductive and resistive pastes onto...

Method of improving electromechanical integrity of cathode coating...

Leadless multi-layered ceramic capacitor stacks

Coefficient of thermal expansion compensating compliant component

Stacked leaded array

Very large ceramic capacitor with mechanical shock resistance

High aspect ratio stacked MLCC design

Method of attaching an electronic device to an MLCC having a curved...

Externally fused and resistively loaded safety capacitor

Electronic component termination and assembly by means of transient...

Method of improving electromechanical integrity of cathode coating...

Leaded multi-layer ceramic capacitor with low ESL and low ESR

Externally fused and resistively loaded safety capacitor

Method of attaching an electronic device to an MLCC having a curved...

Patents Applicationslast 30 patents

Stable Power Modules By Thermoelectric Cooling

Component Stability Structure

Leadless Stack Comprising Multiple Components

Electronic Component Structures with Reduced Microphonic Noise

High Density Multi-Component Packages

High Density Multi-Component Packages

High Density Multi-Component Packages

Stable Power Capacitors by Thermoelectric Cooling

Leadless Multi-Layered Ceramic Capacitor Stack

Component Stability Structure

Leadless Stack Comprising Multiple Components

Multiple MLCC Modules

Bulk MLCC Capacitor Module

Electronic Component Structures with Reduced Microphonic Noise

Electronic Component Termination and Assembly by Means of Transient...

Leadless Multi-Layered Ceramic Capacitor Stacks

Electronic Component Termination and Assembly by Means of Transient...

Multi-Layered Ceramic Capacitor with Soft Leaded Module

Sintering of High Temperature Conductive and Resistive Pastes onto...

Leadless Multi-Layered Ceramic Capacitor Stacks

Method of Improving Electromechanical Integrity of Cathode Coating...

COEFFICIENT OF THERMAL EXPANSION COMPENSATING COMPLIANT COMPONENT

HIGH ASPECT RATIO STACKED MLCC DESIGN

STACKED LEADED ARRAY

SINTERING OF HIGH TEMPERATURE CONDUCTIVE AND RESISTIVE PASTES ONTO...

EXTERNALLY FUSED AND RESISTIVELY LOADED SAFETY CAPACITOR

ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT...

METHOD OF IMPROVING ELECTROMECHANICAL INTEGRITY OF CATHODE COATING...

EXTERNALLY FUSED AND RESISTIVELY LOADED SAFETY CAPACITOR

LEADED MULTI-LAYER CERAMIC CAPACITOR WITH LOW ESL AND LOW ESR