John Edward Heidenreich III

Person

Yorktown Heights, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metal-insulator-metal capacitor in copper
- Patent number 6,750,113
- Issue date Jun 15, 2004
- International Business Machines Corporation
- Michael D. Armacost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced integrated circuits
- Patent number 6,339,024
- Issue date Jan 15, 2002
- International Business Machines Corporation
- Kevin S. Petrarca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method/structure for creating aluminum wirebound pad on copper BEOL
- Patent number 6,333,559
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Gregory Costrini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method/structure for creating aluminum wirebound pad on copper BEOL
- Patent number 6,187,680
- Issue date Feb 13, 2001
- International Business Machines Corporation
- Gregory Costrini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for producing an inductive plasma for plasma processes
- Patent number 5,650,032
- Issue date Jul 22, 1997
- International Business Machines Corporation
- John Howard Keller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a metal organic polymer combination
- Patent number 5,340,451
- Issue date Aug 23, 1994
- International Business Machines Corporation
- Leena P. Buchwalter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for contamination control in processing appara...
- Patent number 5,298,720
- Issue date Mar 29, 1994
- International Business Machines Corporation
- Jerome J. Cuomo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for enhancing the adhesion of polymer surfaces by water vapo...
- Patent number 5,019,210
- Issue date May 28, 1991
- International Business Machines Corporation
- Ned J. Chou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Copper to aluminum interlayer interconnect using stud and via liner
- Publication number 20040207092
- Publication date Oct 21, 2004
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper to aluminum interlayer interconnect using stud and via liner
- Publication number 20020127846
- Publication date Sep 12, 2002
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-insulator-metal capacitor in copper
- Publication number 20020094656
- Publication date Jul 18, 2002
- International Business Machines Corporation
- Michael D. Armacost
- H01 - BASIC ELECTRIC ELEMENTS

John Edward Heidenreich III

Person

Patents Grantslast 30 patents

Metal-insulator-metal capacitor in copper

Reinforced integrated circuits

Method/structure for creating aluminum wirebound pad on copper BEOL

Method/structure for creating aluminum wirebound pad on copper BEOL

Apparatus for producing an inductive plasma for plasma processes

Process for producing a metal organic polymer combination

Method and apparatus for contamination control in processing appara...

Method for enhancing the adhesion of polymer surfaces by water vapo...

Patents Applicationslast 30 patents

Copper to aluminum interlayer interconnect using stud and via liner

Copper to aluminum interlayer interconnect using stud and via liner

Metal-insulator-metal capacitor in copper