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John F. McMahon
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Phoenix, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Stacked chip packaging
Patent number
6,890,798
Issue date
May 10, 2005
Intel Corporation
John F. McMahon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Retention mechanism assembly for processor cartridges with captured...
Patent number
6,208,527
Issue date
Mar 27, 2001
Intel Corporation
John F. McMahon
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Organic substrate (PCB) slip plane “stress deflectorȁ...
Patent number
6,173,489
Issue date
Jan 16, 2001
Intel Corporation
John F. McMahon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip having electrical contact pads on the backside of the chip
Patent number
6,075,712
Issue date
Jun 13, 2000
Intel Corporation
John F. McMahon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Computer package with a polygonal shaped motherboard
Patent number
5,903,432
Issue date
May 11, 1999
Intel Corportation
John Francis McMahon
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
High performance power and ground edge connect IC package
Patent number
5,892,275
Issue date
Apr 6, 1999
Intel Corporation
John Francis McMahon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Design for mounting discrete components inside an integrated circui...
Patent number
5,811,880
Issue date
Sep 22, 1998
Intel Corporation
Koushik Banerjee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit solder-rack interconnect module
Patent number
5,808,875
Issue date
Sep 15, 1998
Intel Corporation
John Francis McMahon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Organic substrate (PCB) slip plane "stress deflector" for flip chip...
Patent number
5,804,771
Issue date
Sep 8, 1998
Intel Corporation
John F. McMahon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip integrated circuit package
Patent number
5,777,345
Issue date
Jul 7, 1998
Intel Corporation
William G. Loder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tape with solder forms for semiconductor devices
Patent number
5,751,068
Issue date
May 12, 1998
Intel Corporation
Jack McMahon
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Shared socket multi-chip module and/or piggyback pin grid array pac...
Patent number
5,734,555
Issue date
Mar 31, 1998
Intel Corporation
John Francis McMahon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Kangaroo multi-package interconnection concept
Patent number
5,671,121
Issue date
Sep 23, 1997
Intel Corporation
John Francis McMahon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tape withh solder forms and methods for transferring solder forms t...
Patent number
5,662,262
Issue date
Sep 2, 1997
Intel Corporation
John Francis McMahon
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Tape with solder forms and methods for transferring solder to chip...
Patent number
5,497,938
Issue date
Mar 12, 1996
Intel Corporation
John F. McMahon
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ra-tab array bump tab tape based I.C. package
Patent number
5,375,041
Issue date
Dec 20, 1994
Intel Corporation
John F. McMahon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making an electronic assembly having a flexible circuit w...
Patent number
5,362,656
Issue date
Nov 8, 1994
Intel Corporation
John F. McMahon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrically conductive interposer and array package concept for in...
Patent number
5,321,583
Issue date
Jun 14, 1994
Intel Corporation
John F. McMahon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chiplid, multichip semiconductor package design concept
Patent number
5,307,240
Issue date
Apr 26, 1994
Intel Corporation
John F. McMahon
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Stacked chip packaging
Publication number
20010006828
Publication date
Jul 5, 2001
John F. McMahon
H01 - BASIC ELECTRIC ELEMENTS