John F. McMahon

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked chip packaging
- Patent number 6,890,798
- Issue date May 10, 2005
- Intel Corporation
- John F. McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retention mechanism assembly for processor cartridges with captured...
- Patent number 6,208,527
- Issue date Mar 27, 2001
- Intel Corporation
- John F. McMahon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Organic substrate (PCB) slip plane “stress deflector&#x0201...
- Patent number 6,173,489
- Issue date Jan 16, 2001
- Intel Corporation
- John F. McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip having electrical contact pads on the backside of the chip
- Patent number 6,075,712
- Issue date Jun 13, 2000
- Intel Corporation
- John F. McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer package with a polygonal shaped motherboard
- Patent number 5,903,432
- Issue date May 11, 1999
- Intel Corportation
- John Francis McMahon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance power and ground edge connect IC package
- Patent number 5,892,275
- Issue date Apr 6, 1999
- Intel Corporation
- John Francis McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Design for mounting discrete components inside an integrated circui...
- Patent number 5,811,880
- Issue date Sep 22, 1998
- Intel Corporation
- Koushik Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit solder-rack interconnect module
- Patent number 5,808,875
- Issue date Sep 15, 1998
- Intel Corporation
- John Francis McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic substrate (PCB) slip plane "stress deflector" for flip chip...
- Patent number 5,804,771
- Issue date Sep 8, 1998
- Intel Corporation
- John F. McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip integrated circuit package
- Patent number 5,777,345
- Issue date Jul 7, 1998
- Intel Corporation
- William G. Loder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape with solder forms for semiconductor devices
- Patent number 5,751,068
- Issue date May 12, 1998
- Intel Corporation
- Jack McMahon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shared socket multi-chip module and/or piggyback pin grid array pac...
- Patent number 5,734,555
- Issue date Mar 31, 1998
- Intel Corporation
- John Francis McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Kangaroo multi-package interconnection concept
- Patent number 5,671,121
- Issue date Sep 23, 1997
- Intel Corporation
- John Francis McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape withh solder forms and methods for transferring solder forms t...
- Patent number 5,662,262
- Issue date Sep 2, 1997
- Intel Corporation
- John Francis McMahon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape with solder forms and methods for transferring solder to chip...
- Patent number 5,497,938
- Issue date Mar 12, 1996
- Intel Corporation
- John F. McMahon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ra-tab array bump tab tape based I.C. package
- Patent number 5,375,041
- Issue date Dec 20, 1994
- Intel Corporation
- John F. McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an electronic assembly having a flexible circuit w...
- Patent number 5,362,656
- Issue date Nov 8, 1994
- Intel Corporation
- John F. McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive interposer and array package concept for in...
- Patent number 5,321,583
- Issue date Jun 14, 1994
- Intel Corporation
- John F. McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplid, multichip semiconductor package design concept
- Patent number 5,307,240
- Issue date Apr 26, 1994
- Intel Corporation
- John F. McMahon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stacked chip packaging
- Publication number 20010006828
- Publication date Jul 5, 2001
- John F. McMahon
- H01 - BASIC ELECTRIC ELEMENTS

John F. McMahon

Person

Patents Grantslast 30 patents

Stacked chip packaging

Retention mechanism assembly for processor cartridges with captured...

Organic substrate (PCB) slip plane &#x0201C;stress deflector&#x0201...

Flip-chip having electrical contact pads on the backside of the chip

Computer package with a polygonal shaped motherboard

High performance power and ground edge connect IC package

Design for mounting discrete components inside an integrated circui...

Integrated circuit solder-rack interconnect module

Organic substrate (PCB) slip plane "stress deflector" for flip chip...

Multi-chip integrated circuit package

Tape with solder forms for semiconductor devices

Shared socket multi-chip module and/or piggyback pin grid array pac...

Kangaroo multi-package interconnection concept

Tape withh solder forms and methods for transferring solder forms t...

Tape with solder forms and methods for transferring solder to chip...

Ra-tab array bump tab tape based I.C. package

Method of making an electronic assembly having a flexible circuit w...

Electrically conductive interposer and array package concept for in...

Chiplid, multichip semiconductor package design concept

Patents Applicationslast 30 patents

Stacked chip packaging

Organic substrate (PCB) slip plane “stress deflector&#x0201...