John F. Valley

Person

Lake Oswego, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cleaved semiconductor wafer imaging system
- Patent number 12,019,031
- Issue date Jun 25, 2024
- GlobalWafers Co., Ltd.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cleaved semiconductor wafer camera system
- Patent number 11,921,054
- Issue date Mar 5, 2024
- GlobalWafers Co., Ltd.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for separating bonded wafer structures
- Patent number 10,910,280
- Issue date Feb 2, 2021
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- B32 - LAYERED PRODUCTS
Information Patent Grant
Cleave systems, mountable cleave monitoring systems, and methods fo...
- Patent number 10,679,908
- Issue date Jun 9, 2020
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer nanotopography metrology for lithography based on thickness maps
- Patent number 10,636,136
- Issue date Apr 28, 2020
- GlobalWafers Co., Ltd.
- John F. Valley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer nanotopography metrology for lithography based on thickness maps
- Patent number 10,062,158
- Issue date Aug 28, 2018
- GlobalWafers Co., Ltd.
- John F. Valley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for performing phase shift interferometry while...
- Patent number 10,030,964
- Issue date Jul 24, 2018
- Sunedison Semiconductor Limited (UEN201334164H)
- Benno Orschel
- G01 - MEASURING TESTING
Information Patent Grant
Air pocket detection methods and systems
- Patent number 9,665,931
- Issue date May 30, 2017
- Sunedison Semiconductor Limited (UEN201334164H)
- John F. Valley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Symmetry based air pocket detection methods and systems
- Patent number 9,317,912
- Issue date Apr 19, 2016
- SunEdison Semiconductor Limited
- John F. Valley
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CLEAVED SEMICONDUCTOR WAFER IMAGING SYSTEM
- Publication number 20220084857
- Publication date Mar 17, 2022
- GLOBALWAFERS CO., LTD.
- Benjamin Michael Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEAVED SEMICONDUCTOR WAFER CAMERA SYSTEM
- Publication number 20220082510
- Publication date Mar 17, 2022
- GLOBALWAFERS CO., LTD.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF PROCESSING A CLEAVED SEMICONDUCTOR WAFER
- Publication number 20220084892
- Publication date Mar 17, 2022
- GLOBALWAFERS CO., LTD.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS FOR SEPARATING BONDED WAFER STRUCTURES
- Publication number 20190206745
- Publication date Jul 4, 2019
- GLOBALWAFERS CO., LTD.
- Justin Scott Kayser
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER NANOTOPOGRAPHY METROLOGY FOR LITHOGRAPHY BASED ON THICKNESS MAPS
- Publication number 20180374206
- Publication date Dec 27, 2018
- GLOBALWAFERS CO., LTD.
- John F. Valley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CLEAVE SYSTEMS, MOUNTABLE CLEAVE MONITORING SYSTEMS, AND METHODS FO...
- Publication number 20180211889
- Publication date Jul 26, 2018
- SunEdison Semiconductor Limited (UEN201334164H)
- Justin Scott Kayser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PERFORMING PHASE SHIFT INTERFEROMETRY WHILE...
- Publication number 20170363413
- Publication date Dec 21, 2017
- SunEdison Semiconductor Limited
- Benno ORSCHEL
- G01 - MEASURING TESTING
Information Patent Application
WAFER NANOTOPOGRAPHY METROLOGY FOR LITHOGRAPHY BASED ON THICKNESS MAPS
- Publication number 20170011505
- Publication date Jan 12, 2017
- SunEdison Semiconductor Limited (UEN201334164H)
- John F. Valley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Air Pocket Detection Methods and Systems
- Publication number 20130176454
- Publication date Jul 11, 2013
- MEMC Electronic Materials, Inc.
- John F. Valley
- G01 - MEASURING TESTING
Information Patent Application
Symmetry Based Air Pocket Detection Methods and Systems
- Publication number 20130179094
- Publication date Jul 11, 2013
- MEMC Electronic Materials, Inc.
- John F. Valley
- G01 - MEASURING TESTING

John F. Valley

Person

Patents Grantslast 30 patents

Cleaved semiconductor wafer imaging system

Cleaved semiconductor wafer camera system

Methods for separating bonded wafer structures

Cleave systems, mountable cleave monitoring systems, and methods fo...

Wafer nanotopography metrology for lithography based on thickness maps

Wafer nanotopography metrology for lithography based on thickness maps

Systems and methods for performing phase shift interferometry while...

Air pocket detection methods and systems

Symmetry based air pocket detection methods and systems

Patents Applicationslast 30 patents

CLEAVED SEMICONDUCTOR WAFER IMAGING SYSTEM

CLEAVED SEMICONDUCTOR WAFER CAMERA SYSTEM

METHOD OF PROCESSING A CLEAVED SEMICONDUCTOR WAFER

METHODS FOR SEPARATING BONDED WAFER STRUCTURES

WAFER NANOTOPOGRAPHY METROLOGY FOR LITHOGRAPHY BASED ON THICKNESS MAPS

CLEAVE SYSTEMS, MOUNTABLE CLEAVE MONITORING SYSTEMS, AND METHODS FO...

SYSTEMS AND METHODS FOR PERFORMING PHASE SHIFT INTERFEROMETRY WHILE...

WAFER NANOTOPOGRAPHY METROLOGY FOR LITHOGRAPHY BASED ON THICKNESS MAPS

Air Pocket Detection Methods and Systems

Symmetry Based Air Pocket Detection Methods and Systems