John G. Arthur

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Copper ball bond interface structure and formation
- Patent number 9,257,403
- Issue date Feb 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Copper Ball Bond Interface Structure and Formation
- Publication number 20150145148
- Publication date May 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS