John G. Bamber

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Corvallis, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Micro electro-mechanical system packaging and interconnect
- Patent number 8,217,473
- Issue date Jul 10, 2012
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Micro electro-mechanical system packaging and interconnect
- Publication number 20070128828
- Publication date Jun 7, 2007
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electro-optical wobulator
- Publication number 20070097323
- Publication date May 3, 2007
- Charles Otis
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Characterizing electron beams
- Publication number 20060212977
- Publication date Sep 21, 2006
- Charles Otis
- B82 - NANO-TECHNOLOGY