John G. Long III

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Baltimore, MD, US

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Patents Grantslast 30 patents

Information Patent Grant
Copper metallization structure and method of construction
- Patent number 6,309,969
- Issue date Oct 30, 2001
- The John Hopkins University
- Gerko Oskam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Copper metallization structure and method of construction
- Publication number 20010001081
- Publication date May 10, 2001
- Gerko Oskam
- H01 - BASIC ELECTRIC ELEMENTS