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John G. Meyers
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Sacramento, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Packaged integrated circuit device with recess structure
Patent number
11,901,274
Issue date
Feb 13, 2024
Intel Corporation
Bin Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System in package with interconnected modules
Patent number
11,817,438
Issue date
Nov 14, 2023
Intel Corporationd
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package
Patent number
11,552,051
Issue date
Jan 10, 2023
Intel Corporation
Florence R. Pon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic structures having notched microelectronic substrates
Patent number
11,335,640
Issue date
May 17, 2022
Intel Corporation
John Meyers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die stack with cascade and vertical connections
Patent number
11,171,114
Issue date
Nov 9, 2021
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density die package configuration on system boards
Patent number
11,145,632
Issue date
Oct 12, 2021
Intel Corporation
Juan E. Dominguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Data storage system using wafer-level packaging
Patent number
10,964,682
Issue date
Mar 30, 2021
Intel Corporation
John G. Meyers
G11 - INFORMATION STORAGE
Information
Patent Grant
Method, apparatus and system to interconnect packaged integrated ci...
Patent number
10,910,347
Issue date
Feb 2, 2021
Intel Corporation
Yong She
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pre-molded active IC of passive components to miniaturize system in...
Patent number
10,872,832
Issue date
Dec 22, 2020
Intel Corporation
Mao Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged integrated circuit device with cantilever structure
Patent number
10,490,516
Issue date
Nov 26, 2019
Intel Corporation
John G. Meyers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method, apparatus and system to interconnect packaged integrated ci...
Patent number
10,396,055
Issue date
Aug 27, 2019
Intel Corporation
Yong She
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged integrated circuit device with cantilever structure
Patent number
9,871,007
Issue date
Jan 16, 2018
Intel Corporation
John G. Meyers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging method for circuit board
Patent number
7,533,457
Issue date
May 19, 2009
Intel Corporation
Richard B Foehringer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for packaging a tape substrate
Patent number
7,503,155
Issue date
Mar 17, 2009
John G. Meyers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a multi-die semiconductor package
Patent number
7,498,201
Issue date
Mar 3, 2009
Intel Corporation
John G. Meyers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-die semiconductor package
Patent number
6,927,497
Issue date
Aug 9, 2005
Intel Corporation
John G. Meyers
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DIE STACK WITH CASCADE AND VERTICAL CONNECTIONS
Publication number
20220037291
Publication date
Feb 3, 2022
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC STRUCTURES HAVING NOTCHED MICROELECTRONIC SUBSTRATES
Publication number
20210287993
Publication date
Sep 16, 2021
Intel Corporation
John Meyers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY DIE PACKAGE CONFIGURATION ON SYSTEM BOARDS
Publication number
20200381406
Publication date
Dec 3, 2020
Intel Corporation
Juan E. DOMINGUEZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM IN PACKAGE WITH INTERCONNECTED MODULES
Publication number
20200227393
Publication date
Jul 16, 2020
Intel Corporation
Hyoung Il KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICE WITH RECESS STRUCTURE
Publication number
20200066621
Publication date
Feb 27, 2020
Intel Corporation
Bin LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE PACKAGE
Publication number
20200013756
Publication date
Jan 9, 2020
Intel Corporation
Florence R. Pon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD, APPARATUS AND SYSTEM TO INTERCONNECT PACKAGED INTEGRATED CI...
Publication number
20190341372
Publication date
Nov 7, 2019
Intel Corporation
Yong SHE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-POINT STACKED DIE WIREBONDING FOR IMPROVED POWER DELIVERY
Publication number
20190326249
Publication date
Oct 24, 2019
Intel Corporation
John G. Meyers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DATA STORAGE SYSTEM USING WAFER-LEVEL PACKAGING
Publication number
20190172820
Publication date
Jun 6, 2019
Intel Corporation
John G. MEYERS
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD, APPARATUS AND SYSTEM TO INTERCONNECT PACKAGED INTEGRATED CI...
Publication number
20190019777
Publication date
Jan 17, 2019
Intel Corporation
Yong SHE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONICS PACKAGE DEVICES WITH THROUGH-SUBSTRATE-VIAS HAVING PITC...
Publication number
20190006331
Publication date
Jan 3, 2019
Intel Corporation
Bilal Khalaf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE STACK WITH CASCADE AND VERTICAL CONNECTIONS
Publication number
20180366441
Publication date
Dec 20, 2018
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-MOLDED ACTIVE IC OF PASSIVE COMPONENTS TO MINIATURIZE SYSTEM IN...
Publication number
20180331004
Publication date
Nov 15, 2018
Intel Corporation
Mao GUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICE WITH CANTILEVER STRUCTURE
Publication number
20180138133
Publication date
May 17, 2018
Intel Corporation
John G. Meyers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING A FIDUCIAL MARKER AND METHODS FOR ALI...
Publication number
20180096946
Publication date
Apr 5, 2018
Intel Corporation
John G. Meyers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED PORT IN WEARABLE MOBILE ELECTRONIC DEVICE
Publication number
20170179987
Publication date
Jun 22, 2017
Intel Corporation
John G. Meyers
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICE WITH CANTILEVER STRUCTURE
Publication number
20170092602
Publication date
Mar 30, 2017
John G. Meyers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR PACKAGING A TAPE SUBSTRATE
Publication number
20090133247
Publication date
May 28, 2009
John G. Meyers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaging method and apparatus
Publication number
20070004095
Publication date
Jan 4, 2007
Richard B. Foehringer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of forming a multi-die semiconductor package
Publication number
20050233497
Publication date
Oct 20, 2005
Intel Corporation
John G. Meyers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process and apparatus for packaging a tape substrate
Publication number
20040209400
Publication date
Oct 21, 2004
John G. Meyers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-die semiconductor package
Publication number
20040036163
Publication date
Feb 26, 2004
Intel Corporation
John G. Meyers
H01 - BASIC ELECTRIC ELEMENTS