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John G. Spadafora

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  • Yardville, NJ, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method for bumping silicon devices
    • Patent number 5,505,367
    • Issue date Apr 9, 1996
    • AT&T Corp.
    • Yinon Degani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR