John Gow 3rd

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Owego, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame-chip package with improved configuration
- Patent number 5,168,368
- Issue date Dec 1, 1992
- International Business Machines Corporation
- John Gow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance versatile thermally enhanced IC chip mounting
- Patent number 5,138,430
- Issue date Aug 11, 1992
- International Business Machines Corporation
- John Gow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel integrated circuit packaging structures
- Patent number 5,028,983
- Issue date Jul 2, 1991
- International Business Machines Corporation
- Harry R. Bickford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cermet resistor trimming method
- Patent number 4,191,938
- Issue date Mar 4, 1980
- International Business Machines Corporation
- John Gow
- H01 - BASIC ELECTRIC ELEMENTS