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John Grange
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Cupertino, CA, US
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last 30 patents
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Patent Grant
Metal-jacketed lead manufacturing process using resist layers
Patent number
6,248,656
Issue date
Jun 19, 2001
Tessera, Inc.
David R. Baker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic bonding with lead motion
Patent number
5,619,017
Issue date
Apr 8, 1997
Tessera, Inc.
Thomas H. Distefano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic bonding with lead motion
Patent number
5,491,302
Issue date
Feb 13, 1996
Tessera, Inc.
Thomas H. Distefano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shaped lead structure and method
Patent number
5,398,863
Issue date
Mar 21, 1995
Tessera, Inc.
Gary W. Grube
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor inner lead bonding tool
Patent number
5,390,844
Issue date
Feb 21, 1995
Tessera, Inc.
Thomas H. Distefano
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR