John H. Abbott

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Missouri City, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having resin anti-bleed feature
- Patent number 7,183,657
- Issue date Feb 27, 2007
- Texas Instruments Incorporated
- Robert John Furtaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making plastic package for a surface mounted integrated c...
- Patent number 5,976,914
- Issue date Nov 2, 1999
- Texas Instruments Incorporated
- John H. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic packaging for a surface mounted integrated circuit
- Patent number 5,777,382
- Issue date Jul 7, 1998
- Texas Instruments Incorporated
- John H. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent electronic connection socket
- Patent number 4,540,226
- Issue date Sep 10, 1985
- Texas Instruments Incorporated
- Raymond W. Thompson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Having Resin Anti-Bleed Feature
- Publication number 20070116862
- Publication date May 24, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Robert John Furtaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having resin anti-bleed feature
- Publication number 20060060985
- Publication date Mar 23, 2006
- Robert John Furtaw
- H01 - BASIC ELECTRIC ELEMENTS