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John Hon Shing LAU
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Palo Alto, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Thermally-enhanced provision of underfill to electronic devices usi...
Patent number
9,583,366
Issue date
Feb 28, 2017
ASM Technology Singapore Pte. Ltd.
Qinglong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Positioning method for attaching a solder ball to an electrical con...
Patent number
6,299,058
Issue date
Oct 9, 2001
Hon Hai Precision Ind. Co., Ltd.
John H. Lau
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Low-cost surface-mount compatible land-grid array (LGA) chip scale...
Patent number
6,075,710
Issue date
Jun 13, 2000
Express Packaging Systems, Inc.
John H. Lau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat spreader with a placement recess and bottom saw-teeth for conn...
Patent number
6,057,601
Issue date
May 2, 2000
Express Packaging Systems, Inc.
John H. Lau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Single-core two-side substrate with u-strip and co-planar signal tr...
Patent number
5,825,084
Issue date
Oct 20, 1998
Express Packaging Systems, Inc.
John H. Lau
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
THERMALLY-ENHANCED PROVISION OF UNDERFILL TO ELECTRONIC DEVICES
Publication number
20160276177
Publication date
Sep 22, 2016
ASM Technology Singapore Pte Ltd
Qinglong ZHANG
H01 - BASIC ELECTRIC ELEMENTS