John J. Bandy

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Cambridge, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Substrate edge clamping force tester
- Patent number 9,581,532
- Issue date Feb 28, 2017
- International Business Machines Corporation
- John J. Bandy
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for calibrating sensors that detect wafer prot...
- Patent number 9,348,057
- Issue date May 24, 2016
- International Business Machines Corporation
- John J. Bandy
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for removing a CMP pad from a platen
- Patent number 9,221,241
- Issue date Dec 29, 2015
- GLOBALFOUNDRIES Inc.
- John J. Bandy
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for removing a CMP pad from a platen
- Patent number 8,715,460
- Issue date May 6, 2014
- International Business Machines Corporation
- John J. Bandy
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE EDGE CLAMPING FORCE TESTER
- Publication number 20160161381
- Publication date Jun 9, 2016
- International Business Machines Corporation
- John J. Bandy
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR CALIBRATING SENSORS THAT DETECT WAFER PROT...
- Publication number 20160025893
- Publication date Jan 28, 2016
- International Business Machines Corporation
- John J. Bandy
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND METHOD FOR REMOVING A CMP PAD FROM A PLATEN
- Publication number 20140174670
- Publication date Jun 26, 2014
- International Business Machines Corporation
- John J. Bandy
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS AND METHOD FOR REMOVING A CMP PAD FROM A PLATEN
- Publication number 20130174987
- Publication date Jul 11, 2013
- International Business Machines Corporation
- John J. Bandy
- B32 - LAYERED PRODUCTS