John J. Beatty

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package with a highly conductive layer deposited on die using throu...
- Patent number 11,776,869
- Issue date Oct 3, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having sealant bridge
- Patent number 11,676,873
- Issue date Jun 13, 2023
- Intel Corporation
- Dinesh Padmanabhan Ramalekshmi Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-level backside metallization (BSM)
- Patent number 11,652,061
- Issue date May 16, 2023
- Intel Corporation
- Shenavia S. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader edge standoffs for managing bondline thickness in mic...
- Patent number 11,652,018
- Issue date May 16, 2023
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with a highly conductive layer deposited on die using throu...
- Patent number 11,328,978
- Issue date May 10, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated posts and heat spreader customization for enha...
- Patent number 11,328,979
- Issue date May 10, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader edge standoffs for managing bondline thickness in mic...
- Patent number 11,062,970
- Issue date Jul 13, 2021
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoff spacers for managing bondline thickness in microelectronic...
- Patent number 10,643,938
- Issue date May 5, 2020
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, and a method for forming a semiconductor pac...
- Patent number 10,290,592
- Issue date May 14, 2019
- Intel Corporation
- John J Beatty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-reference integrated heat spreader (IHS) solution
- Patent number 9,806,002
- Issue date Oct 31, 2017
- Intel Corporation
- Arnab Choudhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a plurality of electronic assemblies
- Patent number 8,709,869
- Issue date Apr 29, 2014
- Intel Corporation
- John J. Beatty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an electronic assembly
- Patent number 7,421,778
- Issue date Sep 9, 2008
- Intel Corporation
- Jason A. Garcia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly having multi-material interconnects
- Patent number 7,183,493
- Issue date Feb 27, 2007
- Intel Corporation
- Jason A. Garcia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retractable ledge socket
- Patent number 7,179,093
- Issue date Feb 20, 2007
- Intel Corporation
- Nicholas L. Holmberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BACKSIDE INTEGRATED TORSION LOADING MECHANISM
- Publication number 20230395460
- Publication date Dec 7, 2023
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH A HIGHLY CONDUCTIVE LAYER DEPOSITED ON DIE USING THROU...
- Publication number 20220238411
- Publication date Jul 28, 2022
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...
- Publication number 20210305118
- Publication date Sep 30, 2021
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-LEVEL BACKSIDE METALLIZATION (BSM)
- Publication number 20200395307
- Publication date Dec 17, 2020
- Intel Corporation
- Shenavia S. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH A HIGHLY CONDUCTIVE LAYER DEPOSITED ON DIE USING THROU...
- Publication number 20200227335
- Publication date Jul 16, 2020
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED POSTS AND HEAT SPREADER CUSTOMIZATION FOR ENHA...
- Publication number 20200194335
- Publication date Jun 18, 2020
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING SEALANT BRIDGE
- Publication number 20200185290
- Publication date Jun 11, 2020
- Intel Corporation
- Dinesh PADMANABHAN RAMALEKSHMI THANU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...
- Publication number 20190067153
- Publication date Feb 28, 2019
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWAGING PROCESS FOR COMPLEX INTEGRATED HEAT SPREADERS
- Publication number 20190043778
- Publication date Feb 7, 2019
- Zhizhong TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package, and a Method for Forming a Semiconductor Pac...
- Publication number 20190006293
- Publication date Jan 3, 2019
- Intel Corporation
- John J Beatty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDOFF SPACERS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC...
- Publication number 20180350712
- Publication date Dec 6, 2018
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ACTIVATED SWITCH
- Publication number 20170287664
- Publication date Oct 5, 2017
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-reference integrated heat spreader (IHS) solution
- Publication number 20170186665
- Publication date Jun 29, 2017
- Arnab Choudhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A PLURALITY OF ELECTRONIC ASSEMBLIES
- Publication number 20130032953
- Publication date Feb 7, 2013
- John J. Beatty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETRACTABLE LEDGE SOCKET
- Publication number 20070004246
- Publication date Jan 4, 2007
- Nicholas L. Holmberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic assembly having multi-material interconnects
- Publication number 20060162959
- Publication date Jul 27, 2006
- Jason A. Garcia
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of manufacturing a plurality of electronic assemblies
- Publication number 20060019468
- Publication date Jan 26, 2006
- John J. Beatty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly having multi-material interconnects
- Publication number 20060001159
- Publication date Jan 5, 2006
- Jason A. Garcia
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Capillary underfill channel
- Publication number 20050218528
- Publication date Oct 6, 2005
- John J. Beatty
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

John J. Beatty

Person

Patents Grantslast 30 patents

Package with a highly conductive layer deposited on die using throu...

Semiconductor package having sealant bridge

Package-level backside metallization (BSM)

Heat spreader edge standoffs for managing bondline thickness in mic...

Package with a highly conductive layer deposited on die using throu...

Substrate integrated posts and heat spreader customization for enha...

Heat spreader edge standoffs for managing bondline thickness in mic...

Standoff spacers for managing bondline thickness in microelectronic...

Semiconductor package, and a method for forming a semiconductor pac...

Multi-reference integrated heat spreader (IHS) solution

Method of manufacturing a plurality of electronic assemblies

Method of making an electronic assembly

Electronic assembly having multi-material interconnects

Retractable ledge socket

Patents Applicationslast 30 patents

BACKSIDE INTEGRATED TORSION LOADING MECHANISM

PACKAGE WITH A HIGHLY CONDUCTIVE LAYER DEPOSITED ON DIE USING THROU...

HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...

PACKAGE-LEVEL BACKSIDE METALLIZATION (BSM)

PACKAGE WITH A HIGHLY CONDUCTIVE LAYER DEPOSITED ON DIE USING THROU...

SUBSTRATE INTEGRATED POSTS AND HEAT SPREADER CUSTOMIZATION FOR ENHA...

SEMICONDUCTOR PACKAGE HAVING SEALANT BRIDGE

HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...

SWAGING PROCESS FOR COMPLEX INTEGRATED HEAT SPREADERS

Semiconductor Package, and a Method for Forming a Semiconductor Pac...

STANDOFF SPACERS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC...

THERMALLY ACTIVATED SWITCH

Multi-reference integrated heat spreader (IHS) solution

METHOD OF MANUFACTURING A PLURALITY OF ELECTRONIC ASSEMBLIES

RETRACTABLE LEDGE SOCKET

Electronic assembly having multi-material interconnects

Method of manufacturing a plurality of electronic assemblies

Electronic assembly having multi-material interconnects

Capillary underfill channel