John J. Budnaitis

Person

Eau Claire, WI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level contact sheet and method of assembly
- Patent number 6,313,411
- Issue date Nov 6, 2001
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constraining ring for use in electronic packaging
- Patent number 6,184,589
- Issue date Feb 6, 2001
- John J. Budnaitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a high planarity, low CTE base for semiconductor r...
- Patent number 6,046,060
- Issue date Apr 4, 2000
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- G01 - MEASURING TESTING
Information Patent Grant
Constraining ring for use in electronic packaging
- Patent number 6,011,697
- Issue date Jan 4, 2000
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a wafer level contact sheet having a permanent z-...
- Patent number 5,966,593
- Issue date Oct 12, 1999
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level burn-in system
- Patent number 5,966,022
- Issue date Oct 12, 1999
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- G01 - MEASURING TESTING
Information Patent Grant
Method for performing reliability screening and burn-in of semi-con...
- Patent number 5,909,123
- Issue date Jun 1, 1999
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- G01 - MEASURING TESTING
Information Patent Grant
Method of wafer level burn-in
- Patent number 5,896,038
- Issue date Apr 20, 1999
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level burn-in base unit substrate and assembly
- Patent number 5,886,535
- Issue date Mar 23, 1999
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- G01 - MEASURING TESTING
Information Patent Grant
Constraining ring for use in electronic packaging
- Patent number 5,879,786
- Issue date Mar 9, 1999
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High planarity and low thermal coefficient of expansion base for se...
- Patent number 5,830,565
- Issue date Nov 3, 1998
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level contact sheet and method of assembly
- Patent number 5,766,979
- Issue date Jun 16, 1998
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF WAFER LEVEL BURN-IN
- Publication number 20020021138
- Publication date Feb 21, 2002
- JOHN J. BUDNAITIS
- G01 - MEASURING TESTING

John J. Budnaitis

Person

Patents Grantslast 30 patents

Wafer level contact sheet and method of assembly

Constraining ring for use in electronic packaging

Method of making a high planarity, low CTE base for semiconductor r...

Constraining ring for use in electronic packaging

Method of forming a wafer level contact sheet having a permanent z-...

Wafer level burn-in system

Method for performing reliability screening and burn-in of semi-con...

Method of wafer level burn-in

Wafer level burn-in base unit substrate and assembly

Constraining ring for use in electronic packaging

High planarity and low thermal coefficient of expansion base for se...

Wafer level contact sheet and method of assembly

Patents Applicationslast 30 patents

METHOD OF WAFER LEVEL BURN-IN