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John J. Callahan

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  • Wilmington, MA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor laser assembly and packaging system
    • Patent number 10,686,293
    • Issue date Jun 16, 2020
    • SemiNex Corporation
    • David M. Bean
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Semiconductor laser assembly and packaging system
    • Patent number 9,537,284
    • Issue date Jan 3, 2017
    • SemiNex Corporation
    • David M. Bean
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Contact-based encapsulation
    • Patent number 9,147,635
    • Issue date Sep 29, 2015
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor laser assembly and packaging system
    • Patent number 8,811,439
    • Issue date Aug 19, 2014
    • SemiNex Corporation
    • David M. Bean
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Profiled contact
    • Patent number 8,154,131
    • Issue date Apr 10, 2012
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Handheld laser device
    • Patent number D649636
    • Issue date Nov 29, 2011
    • SemiNex Corporation
    • David M. Bean
    • D24 - Medical and laboratory equipment
  • Information Patent Grant

    Patterned contact
    • Patent number 7,989,958
    • Issue date Aug 2, 2011
    • Cufer Assett Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip connector
    • Patent number 7,884,483
    • Issue date Feb 8, 2011
    • Cufer Asset Ltd. L.L.C.
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic chip contact structure
    • Patent number 7,781,886
    • Issue date Aug 24, 2010
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Post & penetration interconnection
    • Patent number 7,767,493
    • Issue date Aug 3, 2010
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Post-seed deposition process
    • Patent number 7,598,163
    • Issue date Oct 6, 2009
    • John Callahan
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SYSTEM FOR SURVIVABILITY OF MICROELECTRONICS IN EXTREME TEMPERATURE...
    • Publication number 20240194557
    • Publication date Jun 13, 2024
    • Lockheed Martin Corporation
    • Keith William Lynn
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR LASER ASSEMBLY AND PACKAGING SYSTEM
    • Publication number 20170093122
    • Publication date Mar 30, 2017
    • SEMINEX CORPORATION
    • David M. Bean
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR LASER ASSEMBLY AND PACKAGING SYSTEM
    • Publication number 20140322840
    • Publication date Oct 30, 2014
    • David M. Bean
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PATTERNED CONTACT
    • Publication number 20110275178
    • Publication date Nov 10, 2011
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONTACT-BASED ENCAPSULATION
    • Publication number 20110147932
    • Publication date Jun 23, 2011
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR LASER ASSEMBLY AND PACKAGING SYSTEM
    • Publication number 20110122905
    • Publication date May 26, 2011
    • SemiNex Corporation
    • David M. Bean
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POST-SEED DEPOSITION PROCESS
    • Publication number 20080200022
    • Publication date Aug 21, 2008
    • John Callahan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP CONNECTOR
    • Publication number 20070182020
    • Publication date Aug 9, 2007
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic chip contact structure
    • Publication number 20060278981
    • Publication date Dec 14, 2006
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Tack & fuse chip bonding
    • Publication number 20060281303
    • Publication date Dec 14, 2006
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Patterned contact
    • Publication number 20060278980
    • Publication date Dec 14, 2006
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Post & penetration interconnection
    • Publication number 20060278992
    • Publication date Dec 14, 2006
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Profiled contact
    • Publication number 20060278988
    • Publication date Dec 14, 2006
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip connector
    • Publication number 20060278993
    • Publication date Dec 14, 2006
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Contact-based encapsulation
    • Publication number 20060278966
    • Publication date Dec 14, 2006
    • John Trezza
    • H01 - BASIC ELECTRIC ELEMENTS