John J. Lajza JR.

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Essex Junction, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Planarized plastic package modules for integrated circuits
- Patent number 6,603,195
- Issue date Aug 5, 2003
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra mold for encapsulating very thin packages
- Patent number 6,428,300
- Issue date Aug 6, 2002
- International Business Machines Corporation
- John J. Lajza
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Ultra mold for encapsulating very thin packages
- Patent number 6,306,331
- Issue date Oct 23, 2001
- International Business Machines Corporation
- John J. Lajza
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Self aligned schottky guard ring
- Patent number 4,261,095
- Issue date Apr 14, 1981
- International Business Machines Corporation
- Richard F. Dreves
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ultra mold for encapsulating very thin packages
- Publication number 20010030382
- Publication date Oct 18, 2001
- International Business Machines Corporation
- John J. Lajza
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL