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John J. Tang
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Shanghai, CN
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last 30 patents
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Patent Grant
Integrated capacitors in package-level structures, processes of mak...
Patent number
7,989,916
Issue date
Aug 2, 2011
Intel Corporation
John J. Tang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Copper plating connection for multi-die stack in substrate package
Patent number
7,981,726
Issue date
Jul 19, 2011
Intel Corporation
John J. Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated capacitors in package-level structures, processes of mak...
Patent number
7,670,919
Issue date
Mar 2, 2010
Intel Corporation
John J. Tang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Dual die package with high-speed interconnect
Patent number
7,511,359
Issue date
Mar 31, 2009
Intel Corporation
John J. Tang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Integrated capacitors in package-level structures, processes of mak...
Publication number
20100059858
Publication date
Mar 11, 2010
John J. Tang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Integrated capacitors in package-level structures, processes of mak...
Publication number
20070158818
Publication date
Jul 12, 2007
John J. Tang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Dual die package with high-speed interconnect
Publication number
20070152312
Publication date
Jul 5, 2007
Intel Corporation
John J. Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Copper plating connection for multi-die stack in substrate package
Publication number
20070132082
Publication date
Jun 14, 2007
Intel Corporation
John J. Tang
H01 - BASIC ELECTRIC ELEMENTS