TREA

John Kevin TAYLOR

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  • Portland, OR, US
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Patents Applicationslast 30 patents

  • Information Patent Application

    THROUGH-SILICON VIA DIE
    • Publication number 20240363490
    • Publication date Oct 31, 2024
    • Intel Corporation
    • Mohammad Enamul KABIR
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HERMETIC BARRIER SURROUNDING A PLURALITY OF DIES
    • Publication number 20230197638
    • Publication date Jun 22, 2023
    • Mohammad Enamul KABIR
    • H01 - BASIC ELECTRIC ELEMENTS