John M. Cutchaw

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bubble generation in condensation wells for cooling high density in...
- Patent number 4,884,169
- Issue date Nov 28, 1989
- Technology Enterprises Company
- John M. Cutchaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cooling high-density integrated circuit packages
- Patent number 4,730,665
- Issue date Mar 15, 1988
- Technology Enterprises Company
- John M. Cutchaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cooling high-density integrated circuit packages
- Patent number 4,612,978
- Issue date Sep 23, 1986
- John M. Cutchaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cooling high-density integrated circuit packages
- Patent number 4,531,146
- Issue date Jul 23, 1985
- John M. Cutchaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cooling high-density integrated circuit packages
- Patent number 4,381,032
- Issue date Apr 26, 1983
- John M. Cutchaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooled connector for integrated circuit packages
- Patent number 4,341,432
- Issue date Jul 27, 1982
- John M. Cutchaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector for integrated circuit packages
- Patent number 4,293,175
- Issue date Oct 6, 1981
- John M. Cutchaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooled connector for large scale integrated circuit packages
- Patent number 4,166,665
- Issue date Sep 4, 1979
- John M. Cutchaw
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated circuit package and connector therefor
- Patent number 4,164,003
- Issue date Aug 7, 1979
- John M. Cutchaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector for leadless integrated circuit packages
- Patent number 4,063,791
- Issue date Dec 20, 1977
- John M. Cutchaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and handling device for multilead electronic packages
- Patent number 3,997,227
- Issue date Dec 14, 1976
- John M. Cutchaw
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

John M. Cutchaw

Person

Patents Grantslast 30 patents

Bubble generation in condensation wells for cooling high density in...

Apparatus for cooling high-density integrated circuit packages

Apparatus for cooling high-density integrated circuit packages

Apparatus for cooling high-density integrated circuit packages

Apparatus for cooling high-density integrated circuit packages

Liquid cooled connector for integrated circuit packages

Connector for integrated circuit packages

Liquid cooled connector for large scale integrated circuit packages

Integrated circuit package and connector therefor

Connector for leadless integrated circuit packages

Connector and handling device for multilead electronic packages