John M. Drynan

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect line selectively isolated from an underlying contact plug
- Patent number 9,123,786
- Issue date Sep 1, 2015
- Micron Technology, Inc.
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect line selectively isolated from an underlying contact plug
- Patent number 8,796,815
- Issue date Aug 5, 2014
- Micron Technology, Inc.
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect line selectively isolated from an underlying contact plug
- Patent number 7,888,774
- Issue date Feb 15, 2011
- Micron Technology, Inc.
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect line selectively isolated from an underlying contact plug
- Patent number 7,573,087
- Issue date Aug 11, 2009
- Micron Technology, Inc.
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions comprising multi-level patterns of radi...
- Patent number 7,535,112
- Issue date May 19, 2009
- Micron Technology, Inc.
- John Aiton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire bonds for semiconductor constructions
- Patent number 7,517,786
- Issue date Apr 14, 2009
- Micron Technology, Inc.
- John Aiton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device precursor structures to a double-sided capacit...
- Patent number 7,321,150
- Issue date Jan 22, 2008
- Micron Technology, Inc.
- Fred Fishburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic random access memory circuitry and integrated circuitry
- Patent number 7,285,814
- Issue date Oct 23, 2007
- Micron Technology, Inc.
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a double-sided capacitor
- Patent number 7,273,779
- Issue date Sep 25, 2007
- Micron Technology, Inc.
- Fred Fishburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a contact using a sacrificial structure
- Patent number 7,268,039
- Issue date Sep 11, 2007
- Micron Technology, Inc.
- Fred Fishburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire bonds for semiconductor constructions
- Patent number 7,262,123
- Issue date Aug 28, 2007
- Micron Technology, Inc.
- John Aiton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect line selectively isolated from an underlying contact plug
- Patent number 7,061,115
- Issue date Jun 13, 2006
- Micron Technology, Inc.
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization of metal container structures
- Patent number 7,053,462
- Issue date May 30, 2006
- Micron Technology, Inc.
- Sam Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic random access memory circuitry comprising insulative collars
- Patent number 7,019,347
- Issue date Mar 28, 2006
- Micron Technology, Inc.
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect line selectively isolated from an underlying contact plug
- Patent number 6,969,882
- Issue date Nov 29, 2005
- Micron Technology, Inc.
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a double-sided capacitor or a contact using a sa...
- Patent number 6,962,846
- Issue date Nov 8, 2005
- Micron Technology, Inc.
- Fred Fishburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry comprising insulative collars and integrated c...
- Patent number 6,861,713
- Issue date Mar 1, 2005
- Micron Technology, Inc.
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect line selectively isolated from an underlying contact plug
- Patent number 6,781,182
- Issue date Aug 24, 2004
- Micron Technology, Inc.
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
METHOD OF FORMING A PATTERNED SUBSTANTIALLY CRYSTALLINE TA2O5 COMPR...
- Patent number 6,767,806
- Issue date Jul 27, 2004
- Cem Basceri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect line selectively isolated from an underlying contact plug
- Patent number 6,713,378
- Issue date Mar 30, 2004
- Micron Technology, Inc.
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive contacts to conductive structures
- Patent number 6,645,846
- Issue date Nov 11, 2003
- Micron Technology, Inc.
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of depositing a layer comprising tungsten and methods of fo...
- Patent number 6,617,250
- Issue date Sep 9, 2003
- Micron Technology, Inc.
- Cem Basceri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization of metal container structures
- Patent number 6,524,912
- Issue date Feb 25, 2003
- Micron Technology, Inc.
- Sam Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching a substantially amorphous TA2O5 comprising layer
- Patent number 6,511,896
- Issue date Jan 28, 2003
- Micron Technology, Inc.
- Cem Basceri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect line selectively isolated from an underlying contact plug
- Patent number 6,511,879
- Issue date Jan 28, 2003
- Micron Technology, Inc.
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT LINE SELECTIVELY ISOLATED FROM AN UNDERLYING CONTACT PLUG
- Publication number 20140312504
- Publication date Oct 23, 2014
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LINE SELECTIVELY ISOLATED FROM AN UNDERLYING CONTACT PLUG
- Publication number 20110115008
- Publication date May 19, 2011
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LINE SELECTIVELY ISOLATED FROM AN UNDERLYING CONTACT PLUG
- Publication number 20100013048
- Publication date Jan 21, 2010
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a contact using a sacrificial structure
- Publication number 20070141777
- Publication date Jun 21, 2007
- Fred Fishburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect line selectively isolated from an underlying contact plug
- Publication number 20070096190
- Publication date May 3, 2007
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor constructions comprising multi-level patterns of radi...
- Publication number 20070072343
- Publication date Mar 29, 2007
- John Aiton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming wire bonds for semiconductor constructions
- Publication number 20060246705
- Publication date Nov 2, 2006
- John Aiton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Planarization of metal container structures
- Publication number 20060170025
- Publication date Aug 3, 2006
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dynamic random assess memory circuitry and integrated circuitry
- Publication number 20060157767
- Publication date Jul 20, 2006
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect line selectively isolated from an underlying contact plug
- Publication number 20060033123
- Publication date Feb 16, 2006
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor constructions comprising multi-level patterns of radi...
- Publication number 20060024942
- Publication date Feb 2, 2006
- John Aiton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming a double-sided capacitor or a contact using a sa...
- Publication number 20050208729
- Publication date Sep 22, 2005
- Fred Fishburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dynamic random access memory circuitry comprising insulative collars
- Publication number 20050124163
- Publication date Jun 9, 2005
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device precursor structures to a double-sided capacit...
- Publication number 20050118760
- Publication date Jun 2, 2005
- Fred Fishburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A DOUBLE-SIDED CAPACITOR OR A CONTACT USING A SA...
- Publication number 20050106806
- Publication date May 19, 2005
- Fred Fishburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect line selectively isolated from an underlying contact plug
- Publication number 20050026412
- Publication date Feb 3, 2005
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect line selectively isolated from an underlying contact plug
- Publication number 20040262657
- Publication date Dec 30, 2004
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect line selectively isolated from an underlying contact plug
- Publication number 20040108535
- Publication date Jun 10, 2004
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Planarization of metal container structures
- Publication number 20030082903
- Publication date May 1, 2003
- Sam Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect line selectively isolated from an underlying contact plug
- Publication number 20030077891
- Publication date Apr 24, 2003
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming conductive contacts to conductive structures
- Publication number 20030074787
- Publication date Apr 24, 2003
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming conductive contacts to conductive structures, an...
- Publication number 20030075799
- Publication date Apr 24, 2003
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect line selectively isolated from an underlying contact plug
- Publication number 20020187606
- Publication date Dec 12, 2002
- John M. Drynan
- H01 - BASIC ELECTRIC ELEMENTS

John M. Drynan

Person

Patents Grantslast 30 patents

Interconnect line selectively isolated from an underlying contact plug

Interconnect line selectively isolated from an underlying contact plug

Interconnect line selectively isolated from an underlying contact plug

Interconnect line selectively isolated from an underlying contact plug

Semiconductor constructions comprising multi-level patterns of radi...

Methods of forming wire bonds for semiconductor constructions

Semiconductor device precursor structures to a double-sided capacit...

Dynamic random access memory circuitry and integrated circuitry

Method of forming a double-sided capacitor

Method of forming a contact using a sacrificial structure

Methods of forming wire bonds for semiconductor constructions

Interconnect line selectively isolated from an underlying contact plug

Planarization of metal container structures

Dynamic random access memory circuitry comprising insulative collars

Interconnect line selectively isolated from an underlying contact plug

Methods of forming a double-sided capacitor or a contact using a sa...

Integrated circuitry comprising insulative collars and integrated c...

Interconnect line selectively isolated from an underlying contact plug

METHOD OF FORMING A PATTERNED SUBSTANTIALLY CRYSTALLINE TA2O5 COMPR...

Interconnect line selectively isolated from an underlying contact plug

Methods of forming conductive contacts to conductive structures

Methods of depositing a layer comprising tungsten and methods of fo...

Planarization of metal container structures

Method of etching a substantially amorphous TA2O5 comprising layer

Interconnect line selectively isolated from an underlying contact plug

Patents Applicationslast 30 patents

INTERCONNECT LINE SELECTIVELY ISOLATED FROM AN UNDERLYING CONTACT PLUG

INTERCONNECT LINE SELECTIVELY ISOLATED FROM AN UNDERLYING CONTACT PLUG

INTERCONNECT LINE SELECTIVELY ISOLATED FROM AN UNDERLYING CONTACT PLUG

Method of forming a contact using a sacrificial structure

Interconnect line selectively isolated from an underlying contact plug

Semiconductor constructions comprising multi-level patterns of radi...

Methods of forming wire bonds for semiconductor constructions

Planarization of metal container structures

Dynamic random assess memory circuitry and integrated circuitry

Interconnect line selectively isolated from an underlying contact plug

Semiconductor constructions comprising multi-level patterns of radi...

Methods of forming a double-sided capacitor or a contact using a sa...

Dynamic random access memory circuitry comprising insulative collars

Semiconductor device precursor structures to a double-sided capacit...

METHODS OF FORMING A DOUBLE-SIDED CAPACITOR OR A CONTACT USING A SA...

Interconnect line selectively isolated from an underlying contact plug

Interconnect line selectively isolated from an underlying contact plug

Interconnect line selectively isolated from an underlying contact plug

Planarization of metal container structures

Interconnect line selectively isolated from an underlying contact plug

Methods of forming conductive contacts to conductive structures

Methods of forming conductive contacts to conductive structures, an...

Interconnect line selectively isolated from an underlying contact plug