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John M. Lauffer
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Waverly, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Electrically conductive adhesive (ECA) for multilayer device interc...
Patent number
9,451,693
Issue date
Sep 20, 2016
i3 ELECTRONICS, INC.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate having internal capacitor and method of making same
Patent number
8,607,445
Issue date
Dec 17, 2013
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuitized substrate utilizing three smooth-sided conductive layer...
Patent number
8,502,082
Issue date
Aug 6, 2013
Endicott Interconnect Technologies, Inc.
Benson Chan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming multilayer capacitors in a printed circuit substrate
Patent number
8,501,575
Issue date
Aug 6, 2013
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuitized substrate with dielectric interposer assembly and method
Patent number
8,299,371
Issue date
Oct 30, 2012
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making circuitized substrate with resistor including mate...
Patent number
8,247,703
Issue date
Aug 21, 2012
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making circuitized substrates having film resistors as pa...
Patent number
8,240,027
Issue date
Aug 14, 2012
Endicott Interconnect Technologies, Inc.
Frank D. Egitto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuitized substrates utilizing smooth-sided conductive layers as...
Patent number
8,242,376
Issue date
Aug 14, 2012
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-layer embedded capacitance and resistance substrate core
Patent number
8,144,480
Issue date
Mar 27, 2012
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for making circuitized substrates having photo-imageable die...
Patent number
7,977,034
Issue date
Jul 12, 2011
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Capacitive substrate
Patent number
7,897,877
Issue date
Mar 1, 2011
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making circuitized substrate with a resistor
Patent number
7,870,664
Issue date
Jan 18, 2011
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
LED lighting assembly and lamp utilizing same
Patent number
7,841,741
Issue date
Nov 30, 2010
Endicott Interconnect Technologies, Inc.
Benson Chan
F21 - LIGHTING
Information
Patent Grant
Circuitized substrates utilizing smooth-sided conductive layers as...
Patent number
7,838,776
Issue date
Nov 23, 2010
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus for making circuitized substrates having photo-imageable...
Patent number
7,827,682
Issue date
Nov 9, 2010
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making circuitized substrate with filled isolation border
Patent number
7,814,649
Issue date
Oct 19, 2010
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Capacitive substrate and method of making same
Patent number
7,803,688
Issue date
Sep 28, 2010
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuitized substrate with internal stacked semiconductor chips, me...
Patent number
7,800,916
Issue date
Sep 21, 2010
Endicott Interconnect Technologies, Inc.
Kim J. Blackwell
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-layer embedded capacitance and resistance substrate core
Patent number
7,791,897
Issue date
Sep 7, 2010
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for making a multilayered circuitized substrate
Patent number
7,627,947
Issue date
Dec 8, 2009
Endicott Interconnect Technologies, Inc.
Thomas J. Davis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of improving electrical connections in circuitized substrates
Patent number
7,629,559
Issue date
Dec 8, 2009
Endicott Interconnect Technologies, Inc.
Subahu D. Desai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Capacitor material for use in circuitized substrates, circuitized s...
Patent number
7,541,265
Issue date
Jun 2, 2009
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making a printed circuit board with low cross-talk noise
Patent number
7,530,167
Issue date
May 12, 2009
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Information handling system utilizing circuitized substrate with sp...
Patent number
7,491,896
Issue date
Feb 17, 2009
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making circuitized substrate with signal wire shielding
Patent number
7,478,472
Issue date
Jan 20, 2009
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making a capacitive substrate for use as part of a larger...
Patent number
7,449,381
Issue date
Nov 11, 2008
Endicott Interconect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuitized substrate with solder-coated microparticle paste connec...
Patent number
7,442,879
Issue date
Oct 28, 2008
Endicott Interconect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making a capacitive substrate using photoimageable dielec...
Patent number
7,429,510
Issue date
Sep 30, 2008
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making an internal capacitive substrate for use in a circ...
Patent number
7,384,856
Issue date
Jun 10, 2008
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making circuitized substrates utilizing smooth-sided cond...
Patent number
7,383,629
Issue date
Jun 10, 2008
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Structure and Method of Making Circuitized Substrate Assembly
Publication number
20180156841
Publication date
Jun 7, 2018
i3 Electronics, Inc.
Matthew D. Neely
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERC...
Publication number
20130033827
Publication date
Feb 7, 2013
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF FORMING MULTILAYER CAPACITORS IN A PRINTED CIRCUIT SUBSTRATE
Publication number
20120223047
Publication date
Sep 6, 2012
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUITIZED SUBSTRATE WITH DIELECTRIC INTERPOSER ASSEMBLY AND METHOD
Publication number
20120152605
Publication date
Jun 21, 2012
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MAKING CIRCUITIZED SUBSTRATES HAVING PHOTO-IMAGEABLE DIE...
Publication number
20110173809
Publication date
Jul 21, 2011
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH RESISTOR INCLUDING MATE...
Publication number
20110043987
Publication date
Feb 24, 2011
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Photosensitive dielectric film
Publication number
20110017498
Publication date
Jan 27, 2011
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS...
Publication number
20100328868
Publication date
Dec 30, 2010
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-LAYER EMBEDDED CAPACITANCE AND RESISTANCE SUBSTRATE CORE
Publication number
20100167210
Publication date
Jul 1, 2010
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Mulit-layer embedded capacitance and resistance substrate core
Publication number
20100060381
Publication date
Mar 11, 2010
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuitized substrate and method of making same
Publication number
20090241332
Publication date
Oct 1, 2009
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Capacitive substrate and method of making same
Publication number
20090206051
Publication date
Aug 20, 2009
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of making circuitized substrates having film resistors as pa...
Publication number
20090178271
Publication date
Jul 16, 2009
Endicott Interconnect Technologies, Inc.
Frank D. Egitto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of making circuitized assembly including a plurality of circ...
Publication number
20090178273
Publication date
Jul 16, 2009
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuitized substrates utilizing smooth-sided conductive layers as...
Publication number
20080259581
Publication date
Oct 23, 2008
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of making a circuitized substrate having at least one capaci...
Publication number
20080248596
Publication date
Oct 9, 2008
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuitized substrate with internal stacked semiconductor chips, me...
Publication number
20080244902
Publication date
Oct 9, 2008
Endicott Interconnect Technologies, Inc.
Kim J. Blackwell
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LED lighting assembly and lamp utilizing same
Publication number
20080238323
Publication date
Oct 2, 2008
Endicott Interconnect Technologies, Inc.
Benson Chan
F21 - LIGHTING
Information
Patent Application
Method of making circuitized substrate with resistor including mate...
Publication number
20080151515
Publication date
Jun 26, 2008
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Information handling system utilizing circuitized substrate with sp...
Publication number
20080117583
Publication date
May 22, 2008
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuitized substrate with increased roughness conductive layer as...
Publication number
20080054476
Publication date
Mar 6, 2008
Endicott Interconnect Technologies, Inc.
Frank D. Egitto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Capacitive substrate and method of making same
Publication number
20070275525
Publication date
Nov 29, 2007
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Apparatus for making circuitized substrates in a continuous manner
Publication number
20070266555
Publication date
Nov 22, 2007
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of making circuitized substrate with internal organic memory...
Publication number
20070249089
Publication date
Oct 25, 2007
Endicott Interconnect Technologies, Inc.
Subahu D. Desai
G11 - INFORMATION STORAGE
Information
Patent Application
Method for making a multilayered circuitized substrate
Publication number
20070199195
Publication date
Aug 30, 2007
Endicott Interconnect Technologies, Inc.
Thomas J. Davis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Non-flaking capacitor material, capacitive substrate having an inte...
Publication number
20070177331
Publication date
Aug 2, 2007
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of making circuitized substrate
Publication number
20070166944
Publication date
Jul 19, 2007
Endicott Interconnect Technologies, Inc.
Robert M. Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of making circuitized substrate with split conductive layer...
Publication number
20070144772
Publication date
Jun 28, 2007
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of improving electrical connections in circuitized substrates
Publication number
20070139977
Publication date
Jun 21, 2007
Endicott Interconnect Technologies, Inc.
Subahu D. Desai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of making a printed circuit board with low cross-talk noise
Publication number
20070089290
Publication date
Apr 26, 2007
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR