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John M. Sledziewski
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Hanover, MA, US
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Patents Grants
last 30 patents
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Patent Grant
Method of forming a device by removing a conductive layer of a wafer
Patent number
7,816,165
Issue date
Oct 19, 2010
Analog Devices, Inc.
Timothy J. Brosnihan
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Grant
Method of forming a device by removing a conductive layer of a wafer
Patent number
7,491,566
Issue date
Feb 17, 2009
Analog Devices, Inc.
Timothy J. Brosnihan
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
Method of Forming a Device by Removing a Conductive Layer of a Wafer
Publication number
20090114954
Publication date
May 7, 2009
Analog Devices, Inc.
Timothy J. Brosnihan
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Method of forming a device by removing a conductive layer of a wafer
Publication number
20050176163
Publication date
Aug 11, 2005
Timothy J. Brosnihan
B81 - MICRO-STRUCTURAL TECHNOLOGY