John McKenna Brennan

Person

Doylestown, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for wire bonding with wire length adjustment...
- Patent number 7,637,414
- Issue date Dec 29, 2009
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with substantially perpendicular wire bonds
- Patent number 7,465,655
- Issue date Dec 16, 2008
- Agere Systems Inc.
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for wire bonding with wire length adjustment...
- Patent number 7,443,042
- Issue date Oct 28, 2008
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package
- Patent number 7,242,090
- Issue date Jul 10, 2007
- Agere Systems Inc.
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages
- Patent number 7,235,422
- Issue date Jun 26, 2007
- Agere Systems Inc.
- John M. Brennan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device configured for reducing post-fabrication damage
- Patent number 7,214,568
- Issue date May 8, 2007
- Agere Systems Inc.
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for reducing bowing in power transistor devices
- Patent number 7,164,200
- Issue date Jan 16, 2007
- Agere Systems Inc.
- John McKenna Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with substantially perpendicular wire bonds
- Patent number 7,109,589
- Issue date Sep 19, 2006
- Agere Systems Inc.
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for wire bonding with wire length adjustment...
- Patent number 7,086,148
- Issue date Aug 8, 2006
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging techniques for use with non-ceramic packages
- Patent number 7,075,174
- Issue date Jul 11, 2006
- Agere Systems Inc.
- John McKenna Brennan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods and Apparatus for Wire Bonding with Wire Length Adjustment...
- Publication number 20080283578
- Publication date Nov 20, 2008
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit with substantially perpendicular wire bonds
- Publication number 20060264024
- Publication date Nov 23, 2006
- Agere Systems Inc.
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device having encapsulant dam with chamfered edge
- Publication number 20060170079
- Publication date Aug 3, 2006
- John McKenna Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device package
- Publication number 20060170095
- Publication date Aug 3, 2006
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device packages
- Publication number 20060172465
- Publication date Aug 3, 2006
- John M. Brennan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and apparatus for wire bonding with wire length adjustment...
- Publication number 20060158856
- Publication date Jul 20, 2006
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe designs for plastic cavity transistor packages
- Publication number 20060145317
- Publication date Jul 6, 2006
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die bonded device and method for transistor packages
- Publication number 20060108672
- Publication date May 25, 2006
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit with substantially perpendicular wire bonds
- Publication number 20060043609
- Publication date Mar 2, 2006
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packaging techniques for use with non-ceramic packages
- Publication number 20050191793
- Publication date Sep 1, 2005
- John McKenna Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for reducing bowing in power transistor devices
- Publication number 20050189616
- Publication date Sep 1, 2005
- John McKenna Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with improved thermal characteristics
- Publication number 20050184385
- Publication date Aug 25, 2005
- John McKenna Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for wire bonding with wire length adjustment...
- Publication number 20050183265
- Publication date Aug 25, 2005
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor deivce configured for reducing post-fabrication damage
- Publication number 20050173024
- Publication date Aug 11, 2005
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS

John McKenna Brennan

Person

Patents Grantslast 30 patents

Methods and apparatus for wire bonding with wire length adjustment...

Integrated circuit with substantially perpendicular wire bonds

Methods and apparatus for wire bonding with wire length adjustment...

Device package

Device packages

Semiconductor device configured for reducing post-fabrication damage

Techniques for reducing bowing in power transistor devices

Integrated circuit with substantially perpendicular wire bonds

Methods and apparatus for wire bonding with wire length adjustment...

Semiconductor packaging techniques for use with non-ceramic packages

Patents Applicationslast 30 patents

Methods and Apparatus for Wire Bonding with Wire Length Adjustment...

Integrated circuit with substantially perpendicular wire bonds

Integrated circuit device having encapsulant dam with chamfered edge

Device package

Device packages

Methods and apparatus for wire bonding with wire length adjustment...

Leadframe designs for plastic cavity transistor packages

Die bonded device and method for transistor packages

Integrated circuit with substantially perpendicular wire bonds

Semiconductor packaging techniques for use with non-ceramic packages

Techniques for reducing bowing in power transistor devices

Semiconductor device with improved thermal characteristics

Methods and apparatus for wire bonding with wire length adjustment...

Semiconductor deivce configured for reducing post-fabrication damage