John Melvyn Cullen

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Darlington, GB

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer handling method
- Patent number 6,846,698
- Issue date Jan 25, 2005
- Filtronic Compound Semiconductor Ltd.
- Matthew Francis O'Keefe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of bonding a semiconductor wafer to a support substrate
- Publication number 20070184630
- Publication date Aug 9, 2007
- John Melvyn Cullen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer handling method
- Publication number 20020177257
- Publication date Nov 28, 2002
- Filtronic Compound Semiconductor Limited
- Matthew Francis O'Keefe
- H01 - BASIC ELECTRIC ELEMENTS