John Michael Goward

Person

Ayr, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Formation of nanoporous copper interconnect for electrical connection
- Patent number 11,469,358
- Issue date Oct 11, 2022
- Meta Platforms Technologies, LLC
- John Michael Goward
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect using nanoporous metal locking structures
- Patent number 11,469,199
- Issue date Oct 11, 2022
- Meta Platforms Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting conductive pads with post-transition metal and nanoporou...
- Patent number 11,024,597
- Issue date Jun 1, 2021
- Facebook Technologies, LLC
- John Michael Goward
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding strategies for placement of LEDs from multiple carrier subs...
- Patent number 10,854,801
- Issue date Dec 1, 2020
- Facebook Technologies, LLC
- William Padraic Henry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with carbon nanofiber columns
- Patent number 10,804,207
- Issue date Oct 13, 2020
- Facebook Technologies, LLC
- John Michael Goward
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Interposer for multi-layer display architecture
- Patent number 10,733,930
- Issue date Aug 4, 2020
- Facebook Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect using embedded carbon nanofibers
- Patent number 10,658,349
- Issue date May 19, 2020
- Facebook Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seed layer free nanoporous metal deposition for bonding
- Patent number 10,566,214
- Issue date Feb 18, 2020
- Facebook Technologies, LLC
- John Michael Goward
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fluidic pick-up head for small semiconductor devices
- Patent number 10,453,711
- Issue date Oct 22, 2019
- Facebook Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HERMETICALLY-COVERED PHOTONIC INTEGRATED CIRCUIT (PIC) ON A SUBSTRA...
- Publication number 20240295690
- Publication date Sep 5, 2024
- Meta Platforms Technologies, LLC
- Dusan COSO
- G02 - OPTICS
Information Patent Application
WAVEGUIDE COUPLER FOR COUPLING LASER BEAM INTO PHOTONIC INTEGRATED...
- Publication number 20240230988
- Publication date Jul 11, 2024
- Meta Platforms Technologies, LLC
- Mohit KHURANA
- G02 - OPTICS
Information Patent Application
WAVEGUIDE COUPLER FOR COUPLING LASER BEAM INTO PHOTONIC INTEGRATED...
- Publication number 20240134115
- Publication date Apr 25, 2024
- Meta Platforms Technologies, LLC
- Mohit KHURANA
- G02 - OPTICS
Information Patent Application
INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES
- Publication number 20210098402
- Publication date Apr 1, 2021
- Facebook Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES
- Publication number 20190237420
- Publication date Aug 1, 2019
- Facebook Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR MULTI-LAYER DISPLAY ARCHITECTURE
- Publication number 20190066571
- Publication date Feb 28, 2019
- Facebook Technologies, LLC
- John Michael Goward
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
FLUIDIC PICK-UP HEAD FOR SMALL SEMICONDUCTOR DEVICES
- Publication number 20180351030
- Publication date Dec 6, 2018
- Oculus VR, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS

John Michael Goward

Person

Patents Grantslast 30 patents

Formation of nanoporous copper interconnect for electrical connection

Interconnect using nanoporous metal locking structures

Connecting conductive pads with post-transition metal and nanoporou...

Bonding strategies for placement of LEDs from multiple carrier subs...

Interposer with carbon nanofiber columns

Interposer for multi-layer display architecture

Interconnect using embedded carbon nanofibers

Seed layer free nanoporous metal deposition for bonding

Fluidic pick-up head for small semiconductor devices

Patents Applicationslast 30 patents

HERMETICALLY-COVERED PHOTONIC INTEGRATED CIRCUIT (PIC) ON A SUBSTRA...

WAVEGUIDE COUPLER FOR COUPLING LASER BEAM INTO PHOTONIC INTEGRATED...

WAVEGUIDE COUPLER FOR COUPLING LASER BEAM INTO PHOTONIC INTEGRATED...

INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES

INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES

INTERPOSER FOR MULTI-LAYER DISPLAY ARCHITECTURE

FLUIDIC PICK-UP HEAD FOR SMALL SEMICONDUCTOR DEVICES