John N. Boucher

Person

Tavares, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate dicing method
- Patent number 6,659,843
- Issue date Dec 9, 2003
- John N. Boucher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate dicing method
- Patent number 6,354,909
- Issue date Mar 12, 2002
- John N. Boucher
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Substrate dicing method
- Patent number 6,152,803
- Issue date Nov 28, 2000
- John N. Boucher
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor wafer dicing saw
- Patent number 5,934,973
- Issue date Aug 10, 1999
- John N. Boucher
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Package useful in storing and handling fragile dicing blade
- Patent number 5,819,931
- Issue date Oct 13, 1998
- John N. Boucher
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor wafer dicing method
- Patent number 5,718,615
- Issue date Feb 17, 1998
- John N. Boucher
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor wafer dicing saw
- Patent number D387364
- Issue date Dec 9, 1997
- John N. Boucher
- D15 - Machines not elsewhere specified
Information Patent Grant
Machine tool rotary table locking apparatus
- Patent number 5,676,360
- Issue date Oct 14, 1997
- John N. Boucher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer dicing saw
- Patent number D381668
- Issue date Jul 29, 1997
- John N. Boucher
- D15 - Machines not elsewhere specified
Information Patent Grant
Bowling ball drilling
- Patent number 5,624,215
- Issue date Apr 29, 1997
- John N. Boucher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for packaging and handling fragile dicing blade
- Patent number 5,613,350
- Issue date Mar 25, 1997
- John N. Boucher
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Bowling ball drilling apparatus
- Patent number 5,427,478
- Issue date Jun 27, 1995
- Boucher; John N.
- John N. Boucher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Abrasive blade having a polycrystalline ceramic core
- Patent number 4,787,362
- Issue date Nov 29, 1988
- Thermocarbon, Inc.
- John N. Boucher
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
Substrate dicing method
- Publication number 20040112360
- Publication date Jun 17, 2004
- John N. Boucher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate dicing method
- Publication number 20020193049
- Publication date Dec 19, 2002
- John N. Boucher
- B28 - WORKING CEMENT, CLAY, OR STONE

John N. Boucher

Person

Patents Grantslast 30 patents

Substrate dicing method

Substrate dicing method

Substrate dicing method

Semiconductor wafer dicing saw

Package useful in storing and handling fragile dicing blade

Semiconductor wafer dicing method

Semiconductor wafer dicing saw

Machine tool rotary table locking apparatus

Semiconductor wafer dicing saw

Bowling ball drilling

Method for packaging and handling fragile dicing blade

Bowling ball drilling apparatus

Abrasive blade having a polycrystalline ceramic core

Patents Applicationslast 30 patents

Substrate dicing method

Substrate dicing method