John Newbold

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of encapsulating a wire bonded die
- Patent number 6,022,583
- Issue date Feb 8, 2000
- Nordson Corporation
- Frank Falcone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fitting for a valve switch
- Patent number D420099
- Issue date Feb 1, 2000
- Nordson Corporation
- Alan Lewis
- D23 - Environmental heating and cooling
Information Patent Grant
Dispensing method for epoxy encapsulation of integrated circuits
- Patent number 5,992,688
- Issue date Nov 30, 1999
- Nordson Corporation
- Alan Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispensing pump for epoxy encapsulation of integrated circuits
- Patent number 5,927,560
- Issue date Jul 27, 1999
- Nordson Corporation
- Alan Lewis
- H01 - BASIC ELECTRIC ELEMENTS