John Ni

Follow

Person

San Leandro, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vacuum assisted sealing processes and systems for increasing air ca...
- Patent number 10,115,605
- Issue date Oct 30, 2018
- RJR Technologies, Inc.
- Richard J. Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,759,965
- Issue date Jun 24, 2014
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,639,373
- Issue date Jan 28, 2014
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,560,104
- Issue date Oct 15, 2013
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,283,769
- Issue date Oct 9, 2012
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,153,474
- Issue date Apr 10, 2012
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame moisture barrier for molded plastic electronic packages
- Patent number 6,214,152
- Issue date Apr 10, 2001
- RJR Polymers, Inc.
- Richard J. Ross
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VACUUM ASSISTED SEALING PROCESSES & SYSTEMS FOR INCREASING AIR CAVI...
- Publication number 20180012776
- Publication date Jan 11, 2018
- RJR Technologies, Inc.
- Richard J. Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110086469
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110087356
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110084371
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110084376
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110087353
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS