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John P. Holmes
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San Diego, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Flip-chip device
Patent number
11,417,622
Issue date
Aug 16, 2022
QUALCOMM Incorporated
Yangyang Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package comprising a substrate configured as a heat spreader
Patent number
11,404,343
Issue date
Aug 2, 2022
QUALCOMM Incorporated
David Fraser Rae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on package (PoP) device comprising thermal interface materi...
Patent number
10,002,857
Issue date
Jun 19, 2018
QUALCOMM Incorporated
Michael James Solimando
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...
Publication number
20240072032
Publication date
Feb 29, 2024
QUALCOMM Incorporated
Yanmei SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN TWO METALLIZATION PORT...
Publication number
20240071993
Publication date
Feb 29, 2024
QUALCOMM Incorporated
Yanmei SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENERGY MANAGEMENT
Publication number
20230129230
Publication date
Apr 27, 2023
Honda Motor Co., Ltd.
John H. HOLMES
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
ENERGY MANAGEMENT
Publication number
20230130370
Publication date
Apr 27, 2023
Honda Motor Co., Ltd.
John H. HOLMES
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
METHODS AND SYSTEMS FOR MANAGING VEHICLE-GRID INTEGRATION
Publication number
20230046454
Publication date
Feb 16, 2023
Honda Motor Co., Ltd.
John HOLMES
B60 - VEHICLES IN GENERAL
Information
Patent Application
PACKAGE COMPRISING A SUBSTRATE CONFIGURED AS A HEAT SPREADER
Publication number
20210249325
Publication date
Aug 12, 2021
QUALCOMM Incorporated
David Fraser RAE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP DEVICE
Publication number
20210118834
Publication date
Apr 22, 2021
QUALCOMM Incorporated
Yangyang SUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ON PACKAGE (PoP) DEVICE COMPRISING THERMAL INTERFACE MATERI...
Publication number
20170294422
Publication date
Oct 12, 2017
QUALCOMM Incorporated
Michael James Solimando
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EXPOSED DIE MOLD UNDERFILL (MUF) WITH FINE PITCH COPPER (CU) PILLAR...
Publication number
20170271175
Publication date
Sep 21, 2017
QUALCOMM Incorporated
Christopher James HEALY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Asymmetric Front/Back Solder Mask
Publication number
20110195223
Publication date
Aug 11, 2011
QUALCOMM Incorporated
Omar J. Bchir
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR