John P. Wiley

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
High density circuit board and method of making same
- Patent number 5,191,174
- Issue date Mar 2, 1993
- International Business Machines Corporation
- Chi S. Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bondable via
- Patent number 5,142,775
- Issue date Sep 1, 1992
- International Business Machines Corporation
- John P. Wiley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making multilayer circuit boards having conformal Insulat...
- Patent number 5,114,518
- Issue date May 19, 1992
- International Business Machines Corporation
- Joseph G. Hoffarth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board with reduced susceptability to shorts caus...
- Patent number 4,918,574
- Issue date Apr 17, 1990
- International Business Machines Corporation
- Joseph G. Hoffarth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit member for use in multilayered printed circuit board assemb...
- Patent number 4,916,260
- Issue date Apr 10, 1990
- International Business Machines Corporation
- Cynthia J. Broaddus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance circuit boards
- Patent number 4,868,350
- Issue date Sep 19, 1989
- International Business Machines Corporation
- Joseph G. Hoffarth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low dielectric printed circuit boards
- Patent number 4,864,722
- Issue date Sep 12, 1989
- International Business Machines Corporation
- Donald J. Lazzarini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modularized fabrication of high performance printed circuit boards
- Patent number 4,854,038
- Issue date Aug 8, 1989
- International Business Machines Corporation
- John P. Wiley
- H01 - BASIC ELECTRIC ELEMENTS

John P. Wiley

Person

Patents Grantslast 30 patents

High density circuit board and method of making same

Bondable via

Method of making multilayer circuit boards having conformal Insulat...

Multilayer circuit board with reduced susceptability to shorts caus...

Circuit member for use in multilayered printed circuit board assemb...

High performance circuit boards

Low dielectric printed circuit boards

Modularized fabrication of high performance printed circuit boards