John Pipitone

Person

Livermore, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Physical vapor deposition with isotropic neutral and non-isotropic...
- Patent number 10,648,074
- Issue date May 12, 2020
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition system with a source of isotropic ion vel...
- Patent number 10,400,328
- Issue date Sep 3, 2019
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition method with a source of isotropic ion vel...
- Patent number 9,856,558
- Issue date Jan 2, 2018
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition chamber with capacitive tuning at wafer s...
- Patent number 9,593,411
- Issue date Mar 14, 2017
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for controlling radial distribution of plasma ion density...
- Patent number 9,017,533
- Issue date Apr 28, 2015
- Applied Materials, Inc.
- John C. Forster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling radial distribution of plasma ion density an...
- Patent number 8,920,611
- Issue date Dec 30, 2014
- Applied Materials, Inc.
- John C. Forster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing metal in high aspect ratio features
- Patent number 8,846,451
- Issue date Sep 30, 2014
- Applied Materials, Inc.
- Alan Ritchie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition plasma reactor with RF source power appli...
- Patent number 8,562,798
- Issue date Oct 22, 2013
- Applied Materials, Inc.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing metal in high aspect ratio features
- Patent number 8,563,428
- Issue date Oct 22, 2013
- Applied Materials, Inc.
- Karl Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of performing physical vapor deposition with RF plasma sourc...
- Patent number 8,512,526
- Issue date Aug 20, 2013
- Applied Materials, Inc.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF impedance matching network with secondary frequency and sub-harm...
- Patent number 8,491,759
- Issue date Jul 23, 2013
- COMET Technologies USA, Inc.
- John A. Pipitone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate cleaning chamber and cleaning and conditioning methods
- Patent number 8,435,379
- Issue date May 7, 2013
- Applied Materials, Inc.
- Vineet Mehta
- B08 - CLEANING
Information Patent Grant
Process for removing high stressed film using LF or HF bias power a...
- Patent number 8,123,969
- Issue date Feb 28, 2012
- Applied Materials, Inc.
- Karl M. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical vapor deposition reactor with circularly symmetric RF feed...
- Patent number 8,070,925
- Issue date Dec 6, 2011
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for plasma-enhanced physical vapor deposition of copper with...
- Patent number 8,062,484
- Issue date Nov 22, 2011
- Applied Materials, Inc.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for plasma-enhanced physical vapor deposition of copper w...
- Patent number 7,820,020
- Issue date Oct 26, 2010
- Applied Materials, Inc.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition plasma reactor with arcing suppression
- Patent number 7,804,040
- Issue date Sep 28, 2010
- Applied Materials, Inc.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer pre-clean reactor cable termination for selective suppression...
- Patent number 7,780,814
- Issue date Aug 24, 2010
- Applied Materials, Inc.
- John A. Pipitone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of multi-location ARC sensing with adaptive threshold compar...
- Patent number 7,768,269
- Issue date Aug 3, 2010
- Applied Materials, Inc.
- John Pipitone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System with multi-location arc threshold comparators and communicat...
- Patent number 7,750,644
- Issue date Jul 6, 2010
- Applied Materials, Inc.
- John Pipitone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer level transient sensing, threshold comparison and a...
- Patent number 7,750,645
- Issue date Jul 6, 2010
- Applied Materials, Inc.
- John Pipitone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for wafer level arc detection at an electrostatic chuck e...
- Patent number 7,737,702
- Issue date Jun 15, 2010
- Applied Materials, Inc.
- John Pipitone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for wafer level arc detection at an RF bias impedance mat...
- Patent number 7,733,095
- Issue date Jun 8, 2010
- Applied Materials, Inc.
- John Pipitone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for removing high stressed film using LF or HF bias power a...
- Patent number 7,541,289
- Issue date Jun 2, 2009
- Applied Materials, Inc.
- Karl M. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for metal plasma vapor deposition and re-sputter with sou...
- Patent number 7,399,943
- Issue date Jul 15, 2008
- Applied Materials, Inc.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for metal plasma vapor deposition and re-sputt...
- Patent number 7,268,076
- Issue date Sep 11, 2007
- Applied Materials, Inc.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition plasma reactor with VHF source power appl...
- Patent number 7,244,344
- Issue date Jul 17, 2007
- Applied Materials, Inc.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming a barrier layer in an integrated circuit in a pl...
- Patent number 7,214,619
- Issue date May 8, 2007
- Applied Materials, Inc.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PHYSICAL VAPOR DEPOSITION WITH ISOTROPIC NEUTRAL AND NON-ISOTROPIC...
- Publication number 20190338411
- Publication date Nov 7, 2019
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Physical Vapor Deposition System with a Source of Isotropic Ion Vel...
- Publication number 20180119272
- Publication date May 3, 2018
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE CLEANING CHAMBER AND CLEANING AND CONDITIONING METHODS
- Publication number 20130192629
- Publication date Aug 1, 2013
- Vineet Mehta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PHYSICAL VAPOR DEPOSITION CHAMBER WITH CAPACITIVE TUNING AT WAFER S...
- Publication number 20130008778
- Publication date Jan 10, 2013
- Applied Materials, Inc.
- DANIEL J. HOFFMAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR DEPOSITING METAL IN HIGH ASPECT RATIO FEATURES
- Publication number 20120149192
- Publication date Jun 14, 2012
- Applied Materials, Inc.
- KARL BROWN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RF IMPEDANCE MATCHING NETWORK WITH SECONDARY FREQUENCY AND SUB-HARM...
- Publication number 20120097524
- Publication date Apr 26, 2012
- COMET TECHNOLOGIES USA, INC.
- John A. Pipitone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RF IMPEDANCE MATCHING NETWORK WITH SECONDARY DC INPUT
- Publication number 20120097104
- Publication date Apr 26, 2012
- COMET TECHNOLOGIES USA, INC.
- John A. Pipitone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR DEPOSITING METAL IN HIGH ASPECT RATIO FEATURES
- Publication number 20120028461
- Publication date Feb 2, 2012
- Applied Materials, Inc.
- Alan Ritchie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Ionized Physical Vapor Deposition for Microstructure Controlled Thi...
- Publication number 20100314245
- Publication date Dec 16, 2010
- Applied Materials, Inc.
- Karl Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Ionized Physical Vapor Deposition for Microstructure Controlled Thi...
- Publication number 20100314244
- Publication date Dec 16, 2010
- Applied Materials, Inc.
- Karl Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHYSICAL VAPOR DEPOSITION REACTOR WITH CIRCULARLY SYMMETRIC RF FEED...
- Publication number 20100096261
- Publication date Apr 22, 2010
- Applied Materials, Inc.
- DANIEL J. HOFFMAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTROL OF EROSION PROFILE ON A DIELECTRIC RF SPUTTER TARGET
- Publication number 20100089748
- Publication date Apr 15, 2010
- JOHN C.FORSTER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR CONTROLLING RADIAL DISTRIBUTION OF PLASMA ION DENSITY...
- Publication number 20100012029
- Publication date Jan 21, 2010
- Applied Materials, Inc.
- John C. FORSTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTROLLING RADIAL DISTRIBUTION OF PLASMA ION DENSITY AN...
- Publication number 20100012480
- Publication date Jan 21, 2010
- Applied Materials, Inc.
- John C. Forster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Physical vapor deposition method with a source of isotropic ion vel...
- Publication number 20090229969
- Publication date Sep 17, 2009
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS FOR REMOVING HIGH STRESSED FILM USING LF OR HF BIAS POWER A...
- Publication number 20090197419
- Publication date Aug 6, 2009
- KARL M. BROWN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for wafer level arc detection at an RF bias impedance mat...
- Publication number 20090159439
- Publication date Jun 25, 2009
- Applied Materials, Inc.
- John Pipitone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of wafer level transient sensing, threshold comparison and a...
- Publication number 20090053836
- Publication date Feb 26, 2009
- Applied Materials Inc.
- John Pipitone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus for wafer level arc detection at an electrostatic chuck e...
- Publication number 20090044750
- Publication date Feb 19, 2009
- Applied Materials, Inc.
- John Pipitone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of multi-location ARC sensing with adaptive threshold compar...
- Publication number 20090045046
- Publication date Feb 19, 2009
- Applied Materials, Inc.
- John Pipitone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
System with multi-location arc threshold comparators and communicat...
- Publication number 20090044748
- Publication date Feb 19, 2009
- Applied Materials, Inc.
- John Pipitone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CLEANING CHAMBER AND CLEANING AND CONDITIONING METHODS
- Publication number 20080276958
- Publication date Nov 13, 2008
- APPLIED MATERIALS, INC.
- Vineet Mehta
- B08 - CLEANING
Information Patent Application
PROCESS FOR REMOVING HIGH STRESSED FILM USING LF OR HF BIAS POWER A...
- Publication number 20080014747
- Publication date Jan 17, 2008
- KARL M. BROWN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Physical vapor deposition plasma reactor with arcing suppression
- Publication number 20070193982
- Publication date Aug 23, 2007
- APPLIED MATERIALS, INC.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of performing physical vapor deposition with RF plasma sourc...
- Publication number 20060191876
- Publication date Aug 31, 2006
- APPLIED MATERIALS, INC.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus for plasma-enhanced physical vapor deposition of copper w...
- Publication number 20060172536
- Publication date Aug 3, 2006
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus for plasma-enhanced physical vapor deposition of copper w...
- Publication number 20060169578
- Publication date Aug 3, 2006
- APPLIED MATERIALS, INC.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for plasma-enhanced physical vapor deposition of copper with...
- Publication number 20060172517
- Publication date Aug 3, 2006
- APPLIED MATERIALS, INC.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Physical vapor deposition plasma reactor with VHF source power appl...
- Publication number 20060169576
- Publication date Aug 3, 2006
- APPLIED MATERIALS, INC.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Physical vapor deposition plasma reactor with RF source power appli...
- Publication number 20060169582
- Publication date Aug 3, 2006
- APPLIED MATERIALS, INC.
- Karl M. Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

John Pipitone

Person

Patents Grantslast 30 patents

Physical vapor deposition with isotropic neutral and non-isotropic...

Physical vapor deposition system with a source of isotropic ion vel...

Physical vapor deposition method with a source of isotropic ion vel...

Physical vapor deposition chamber with capacitive tuning at wafer s...

Apparatus for controlling radial distribution of plasma ion density...

Method for controlling radial distribution of plasma ion density an...

Methods for depositing metal in high aspect ratio features

Physical vapor deposition plasma reactor with RF source power appli...

Methods for depositing metal in high aspect ratio features

Method of performing physical vapor deposition with RF plasma sourc...

RF impedance matching network with secondary frequency and sub-harm...

Substrate cleaning chamber and cleaning and conditioning methods

Process for removing high stressed film using LF or HF bias power a...

Physical vapor deposition reactor with circularly symmetric RF feed...

Method for plasma-enhanced physical vapor deposition of copper with...

Apparatus for plasma-enhanced physical vapor deposition of copper w...

Physical vapor deposition plasma reactor with arcing suppression

Wafer pre-clean reactor cable termination for selective suppression...

Method of multi-location ARC sensing with adaptive threshold compar...

System with multi-location arc threshold comparators and communicat...

Method of wafer level transient sensing, threshold comparison and a...

Apparatus for wafer level arc detection at an electrostatic chuck e...

Apparatus for wafer level arc detection at an RF bias impedance mat...

Process for removing high stressed film using LF or HF bias power a...

Apparatus for metal plasma vapor deposition and re-sputter with sou...

Apparatus and method for metal plasma vapor deposition and re-sputt...

Physical vapor deposition plasma reactor with VHF source power appl...

Method for forming a barrier layer in an integrated circuit in a pl...

Patents Applicationslast 30 patents

PHYSICAL VAPOR DEPOSITION WITH ISOTROPIC NEUTRAL AND NON-ISOTROPIC...

Physical Vapor Deposition System with a Source of Isotropic Ion Vel...

SUBSTRATE CLEANING CHAMBER AND CLEANING AND CONDITIONING METHODS

PHYSICAL VAPOR DEPOSITION CHAMBER WITH CAPACITIVE TUNING AT WAFER S...

METHODS FOR DEPOSITING METAL IN HIGH ASPECT RATIO FEATURES

RF IMPEDANCE MATCHING NETWORK WITH SECONDARY FREQUENCY AND SUB-HARM...

RF IMPEDANCE MATCHING NETWORK WITH SECONDARY DC INPUT

METHODS FOR DEPOSITING METAL IN HIGH ASPECT RATIO FEATURES

Ionized Physical Vapor Deposition for Microstructure Controlled Thi...

Ionized Physical Vapor Deposition for Microstructure Controlled Thi...

PHYSICAL VAPOR DEPOSITION REACTOR WITH CIRCULARLY SYMMETRIC RF FEED...

CONTROL OF EROSION PROFILE ON A DIELECTRIC RF SPUTTER TARGET

APPARATUS FOR CONTROLLING RADIAL DISTRIBUTION OF PLASMA ION DENSITY...

METHOD FOR CONTROLLING RADIAL DISTRIBUTION OF PLASMA ION DENSITY AN...

Physical vapor deposition method with a source of isotropic ion vel...

PROCESS FOR REMOVING HIGH STRESSED FILM USING LF OR HF BIAS POWER A...

Apparatus for wafer level arc detection at an RF bias impedance mat...

Method of wafer level transient sensing, threshold comparison and a...

Apparatus for wafer level arc detection at an electrostatic chuck e...

Method of multi-location ARC sensing with adaptive threshold compar...

System with multi-location arc threshold comparators and communicat...

SUBSTRATE CLEANING CHAMBER AND CLEANING AND CONDITIONING METHODS

PROCESS FOR REMOVING HIGH STRESSED FILM USING LF OR HF BIAS POWER A...

Physical vapor deposition plasma reactor with arcing suppression

Method of performing physical vapor deposition with RF plasma sourc...

Apparatus for plasma-enhanced physical vapor deposition of copper w...

Apparatus for plasma-enhanced physical vapor deposition of copper w...

Method for plasma-enhanced physical vapor deposition of copper with...

Physical vapor deposition plasma reactor with VHF source power appl...

Physical vapor deposition plasma reactor with RF source power appli...