John R. Martin

Person

Foxborough, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method of wafer bonding using compatible alloy
- Patent number 8,956,904
- Issue date Feb 17, 2015
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with roughened surface and method of producing the same
- Patent number 8,389,314
- Issue date Mar 5, 2013
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with bonding material having rare earth metal
- Patent number 8,304,861
- Issue date Nov 6, 2012
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of substrate bonding with bonding material having rare Earth...
- Patent number 8,293,582
- Issue date Oct 23, 2012
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method of wafer bonding using compatible alloy
- Patent number 8,288,191
- Issue date Oct 16, 2012
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming MEMS device with weakened substrate
- Patent number 8,241,931
- Issue date Aug 14, 2012
- Analog Devices, Inc.
- Christophe Antoine
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated microphone
- Patent number 8,169,042
- Issue date May 1, 2012
- Analog Devices, Inc.
- Jason W. Weigold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with surface having a low roughness exponent
- Patent number 8,131,006
- Issue date Mar 6, 2012
- Analog Devices, Inc.
- John R. Martin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Micromachined microphone and multisensor and method for producing same
- Patent number 8,129,803
- Issue date Mar 6, 2012
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor with cap electrode
- Patent number 8,100,012
- Issue date Jan 24, 2012
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with bonding material having rare earth metal
- Patent number 7,981,765
- Issue date Jul 19, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method of wafer bonding using compatible alloy
- Patent number 7,943,411
- Issue date May 17, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged chip devices with atomic layer deposition protective films
- Patent number 7,939,932
- Issue date May 10, 2011
- Analog Devices, Inc.
- John R. Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromachined microphone and multisensor and method for producing same
- Patent number 7,825,484
- Issue date Nov 2, 2010
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor system
- Patent number 7,821,084
- Issue date Oct 26, 2010
- Analog Devices, Inc.
- John R. Martin
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Capped sensor
- Patent number 7,795,723
- Issue date Sep 14, 2010
- Analog Devices, Inc.
- Kevin H.-L. Chau
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated microphone
- Patent number 7,795,695
- Issue date Sep 14, 2010
- Analog Devices, Inc.
- Jason W. Weigold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for packaging and sealing an integrated circuit die
- Patent number 7,563,632
- Issue date Jul 21, 2009
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with non-standard profile
- Patent number 7,521,363
- Issue date Apr 21, 2009
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package for sealing an integrated circuit die
- Patent number 7,508,064
- Issue date Mar 24, 2009
- Analog Devices
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of producing a MEMS device
- Patent number 7,416,984
- Issue date Aug 26, 2008
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for wafer level treatment to reduce stiction and passivate...
- Patent number 7,364,942
- Issue date Apr 29, 2008
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive sensor
- Patent number 7,353,711
- Issue date Apr 8, 2008
- Analog Devices, Inc.
- John O'Dowd
- G01 - MEASURING TESTING
Information Patent Grant
Vapor HF etch process mask and method
- Patent number 7,338,614
- Issue date Mar 4, 2008
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Static dissipation treatments for optical package windows
- Patent number 7,338,705
- Issue date Mar 4, 2008
- Analog Devices, Inc.
- John R. Martin
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Sensor system
- Patent number 7,327,003
- Issue date Feb 5, 2008
- Analog Devices, Inc.
- John R. Martin
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Process for wafer level treatment to reduce stiction and passivate...
- Patent number 7,220,614
- Issue date May 22, 2007
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Static dissipation treatments for optical package windows
- Patent number 7,033,672
- Issue date Apr 25, 2006
- Analog Devices, Inc.
- John R. Martin
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Apparatus with selected fill gas
- Patent number 7,017,411
- Issue date Mar 28, 2006
- Analog Devices, Inc.
- John A. Geen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for protecting micro electromechanical systems st...
- Patent number 6,946,326
- Issue date Sep 20, 2005
- Analog Devices, Inc.
- Timothy R. Spooner
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Method of Wafer Bonding Using Compatible Alloy
- Publication number 20130023082
- Publication date Jan 24, 2013
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Substrate Bonding with Bonding Material Having Rare Earth...
- Publication number 20110244630
- Publication date Oct 6, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Substrate Bonding with Bonding Material Having Rare Earth Metal
- Publication number 20110241176
- Publication date Oct 6, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Apparatus and Method of Wafer Bonding Using Compatible Alloy
- Publication number 20110212563
- Publication date Sep 1, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated Microphone
- Publication number 20100289097
- Publication date Nov 18, 2010
- Analog Devices, Inc.
- Jason W. Weigold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micromachined microphone and multisensor and method for producing same
- Publication number 20100285628
- Publication date Nov 11, 2010
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Apparatus and Method of Wafer Bonding Using Compatible Alloy
- Publication number 20100059835
- Publication date Mar 11, 2010
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Substrate Bonding with Bonding Material Having Rare Earth Metal
- Publication number 20100062565
- Publication date Mar 11, 2010
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaged chip devices with atomic layer deposition protective films
- Publication number 20080315334
- Publication date Dec 25, 2008
- Analog Devices, Inc.
- John R. Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum Based Bonding of Semiconductor Wafers
- Publication number 20080237823
- Publication date Oct 2, 2008
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of producing a MEMS device
- Publication number 20080225505
- Publication date Sep 18, 2008
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device with Surface Having a Low Roughness Exponent
- Publication number 20080187154
- Publication date Aug 7, 2008
- Analog Devices, Inc.
- John R. Martin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMS Sensor with Cap Electrode
- Publication number 20080168838
- Publication date Jul 17, 2008
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEADFRAME WITH DIFFERENT TOPOLOGIES FOR MEMS PACKAGE
- Publication number 20080150104
- Publication date Jun 26, 2008
- Michael A. Zimmerman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor System
- Publication number 20080087086
- Publication date Apr 17, 2008
- Analog Devices, Inc.
- John R. Martin
- B60 - VEHICLES IN GENERAL
Information Patent Application
MEMS Device with Roughened Surface and Method of Producing the Same
- Publication number 20080081391
- Publication date Apr 3, 2008
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package for sealing an integrated circuit die
- Publication number 20080061428
- Publication date Mar 13, 2008
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Process for wafer level treatment to reduce stiction and passivate...
- Publication number 20070196945
- Publication date Aug 23, 2007
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated Microphone
- Publication number 20070087466
- Publication date Apr 19, 2007
- Analog Devices, Inc.
- Jason W. Weigold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaged microphone with electrically coupled lid
- Publication number 20070071268
- Publication date Mar 29, 2007
- Analog Devices, Inc.
- Kieran Harney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Partially etched leadframe packages having different top and bottom...
- Publication number 20070040231
- Publication date Feb 22, 2007
- Kieran P. Harney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micromachined microphone and multisensor and method for producing same
- Publication number 20060237806
- Publication date Oct 26, 2006
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Vapor HF etch process mask and method
- Publication number 20060223329
- Publication date Oct 5, 2006
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor system
- Publication number 20060180896
- Publication date Aug 17, 2006
- Analog Devices, Inc.
- John R. Martin
- B60 - VEHICLES IN GENERAL
Information Patent Application
Static dissipation treatments for optical package windows
- Publication number 20060159911
- Publication date Jul 20, 2006
- Analog Devices, Inc.
- John R. Martin
- G02 - OPTICS
Information Patent Application
MEMS device with non-standard profile
- Publication number 20060027885
- Publication date Feb 9, 2006
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of producing a MEMS device
- Publication number 20060027522
- Publication date Feb 9, 2006
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package for sealing an integrated circuit die
- Publication number 20050269678
- Publication date Dec 8, 2005
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Capacitive sensor
- Publication number 20050229710
- Publication date Oct 20, 2005
- John O'Dowd
- G01 - MEASURING TESTING
Information Patent Application
Capped sensor
- Publication number 20050205959
- Publication date Sep 22, 2005
- Kevin H.-L. Chau
- B81 - MICRO-STRUCTURAL TECHNOLOGY

John R. Martin

Person

Patents Grantslast 30 patents

Apparatus and method of wafer bonding using compatible alloy

MEMS device with roughened surface and method of producing the same

Substrate bonding with bonding material having rare earth metal

Method of substrate bonding with bonding material having rare Earth...

Apparatus and method of wafer bonding using compatible alloy

Method of forming MEMS device with weakened substrate

Integrated microphone

MEMS device with surface having a low roughness exponent

Micromachined microphone and multisensor and method for producing same

MEMS sensor with cap electrode

Substrate bonding with bonding material having rare earth metal

Apparatus and method of wafer bonding using compatible alloy

Packaged chip devices with atomic layer deposition protective films

Micromachined microphone and multisensor and method for producing same

Sensor system

Capped sensor

Integrated microphone

Methods for packaging and sealing an integrated circuit die

MEMS device with non-standard profile

Package for sealing an integrated circuit die

Method of producing a MEMS device

Process for wafer level treatment to reduce stiction and passivate...

Capacitive sensor

Vapor HF etch process mask and method

Static dissipation treatments for optical package windows

Sensor system

Process for wafer level treatment to reduce stiction and passivate...

Static dissipation treatments for optical package windows

Apparatus with selected fill gas

Method and device for protecting micro electromechanical systems st...

Patents Applicationslast 30 patents

Apparatus and Method of Wafer Bonding Using Compatible Alloy

Method of Substrate Bonding with Bonding Material Having Rare Earth...

Substrate Bonding with Bonding Material Having Rare Earth Metal

Apparatus and Method of Wafer Bonding Using Compatible Alloy

Integrated Microphone

Micromachined microphone and multisensor and method for producing same

Apparatus and Method of Wafer Bonding Using Compatible Alloy

Substrate Bonding with Bonding Material Having Rare Earth Metal

Packaged chip devices with atomic layer deposition protective films

Aluminum Based Bonding of Semiconductor Wafers

Method of producing a MEMS device

MEMS Device with Surface Having a Low Roughness Exponent

MEMS Sensor with Cap Electrode

LEADFRAME WITH DIFFERENT TOPOLOGIES FOR MEMS PACKAGE

Sensor System

MEMS Device with Roughened Surface and Method of Producing the Same

Package for sealing an integrated circuit die

Process for wafer level treatment to reduce stiction and passivate...

Integrated Microphone

Packaged microphone with electrically coupled lid

Partially etched leadframe packages having different top and bottom...

Micromachined microphone and multisensor and method for producing same

Vapor HF etch process mask and method

Sensor system

Static dissipation treatments for optical package windows

MEMS device with non-standard profile

Method of producing a MEMS device

Package for sealing an integrated circuit die

Capacitive sensor

Capped sensor