John R. Scott

Follow

Person

Torrance, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Encapsulated multi-phase electronics heat-sink
- Patent number 7,561,425
- Issue date Jul 14, 2009
- The Boeing Company
- Eric S. Mindock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATED MULTI-PHASE ELECTRONICS HEAT SINK
- Publication number 20070285892
- Publication date Dec 13, 2007
- The Boeing Company
- Eric S. Mindock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR