John Robert Diroll

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Sandy, UT, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die packages using thin dies and metal substrates
- Patent number 8,329,508
- Issue date Dec 11, 2012
- Fairchild Semiconductor Corporation
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die packages using thin dies and metal substrates
- Patent number 7,768,075
- Issue date Aug 3, 2010
- Fairchild Semiconductor Corporation
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE PACKAGES USING THIN DIES AND METAL SUBSTRATES
- Publication number 20100267200
- Publication date Oct 21, 2010
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die packages using thin dies and metal substrates
- Publication number 20070235886
- Publication date Oct 11, 2007
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS