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John Robert MCMILLAN
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Fontana, CA, US
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last 30 patents
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Patent Grant
Pre-bonded substrate for integrated circuit package and method of m...
Patent number
8,569,110
Issue date
Oct 29, 2013
QPL Limited
John Robert McMillan
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Pre-bonded substrate for integrated circuit package and method of m...
Patent number
8,513,786
Issue date
Aug 20, 2013
QPL Limited
John Robert McMillan
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Substrate for integrated circuit package with selective exposure of...
Patent number
8,338,924
Issue date
Dec 25, 2012
QPL Limited
John Robert McMillan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
PRE-BONDED SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF M...
Publication number
20120146200
Publication date
Jun 14, 2012
John Robert MCMILLAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGE WITH SELECTIVE EXPOSURE OF...
Publication number
20120146199
Publication date
Jun 14, 2012
QPL LIMITED
John Robert MCMILLAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-BONDED SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF M...
Publication number
20120149154
Publication date
Jun 14, 2012
John Robert MCMILLAN
H01 - BASIC ELECTRIC ELEMENTS