John S. Kresge

Person

Binghamton, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making circuitized substrates having film resistors as pa...
- Patent number 8,240,027
- Issue date Aug 14, 2012
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power core for use in circuitized substrate and method of making same
- Patent number 8,198,551
- Issue date Jun 12, 2012
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a circuitized substrate with enhanced circuitry an...
- Patent number 7,595,454
- Issue date Sep 29, 2009
- Endicott Interconnect Technologies, Inc.
- John S. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate
- Patent number 7,163,847
- Issue date Jan 16, 2007
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate
- Patent number 7,091,066
- Issue date Aug 15, 2006
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate
- Patent number 7,084,014
- Issue date Aug 1, 2006
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an electronic package
- Patent number 7,024,764
- Issue date Apr 11, 2006
- International Business Machines Corporation
- John S. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Economical high density chip carrier
- Patent number 6,998,290
- Issue date Feb 14, 2006
- International Business Machines Corporation
- Sylvia Adae-Amoakoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Material separation to form segmented product
- Patent number 6,958,106
- Issue date Oct 25, 2005
- Endicott International Technologies, Inc.
- Timothy E. Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit structure
- Patent number 6,887,779
- Issue date May 3, 2005
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming an electrical structure
- Patent number 6,868,604
- Issue date Mar 22, 2005
- International Business Machines Corporation
- John S. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a multi-layered interconnect structure
- Patent number 6,829,823
- Issue date Dec 14, 2004
- International Business Machines Corporation
- Francis J. Downes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Economical high density chip carrier
- Patent number 6,753,612
- Issue date Jun 22, 2004
- International Business Machines Corporation
- Sylvia Adae-Amoakoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit structure
- Patent number 6,720,502
- Issue date Apr 13, 2004
- International Business Machine Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of a metallic interlocking structure
- Patent number 6,693,031
- Issue date Feb 17, 2004
- International Business Machines Corporation
- Gerald G. Advocate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser ablatable material and its use
- Patent number 6,689,543
- Issue date Feb 10, 2004
- International Business Machines Corporation
- John S. Kresge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tented plated through-holes and method for fabrication thereof
- Patent number 6,562,654
- Issue date May 13, 2003
- International Business Machines Corporation
- John S. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Strain relief for substrates having a low coefficient of thermal ex...
- Patent number 6,559,388
- Issue date May 6, 2003
- International Business Machines Corporation
- John S. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser excision of laminate chip carriers
- Patent number 6,509,546
- Issue date Jan 21, 2003
- International Business Machines Corporation
- Frank D. Egitto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser beam system for micro via formation
- Patent number 6,483,074
- Issue date Nov 19, 2002
- International Business Machines Corporation
- John S. Kresge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with high density interconnect layer
- Patent number 6,373,717
- Issue date Apr 16, 2002
- International Business Machines Corporation
- Francis J. Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablatable material and its use
- Patent number 6,361,923
- Issue date Mar 26, 2002
- International Business Machines Corporation
- John S. Kresge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package for electronic components and method of making same
- Patent number 6,351,393
- Issue date Feb 26, 2002
- International Business Machines Corporation
- John S. Kresge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interlocking structure
- Patent number 6,348,737
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Gerald G. Advocate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relieved ball grid array package
- Patent number 6,341,071
- Issue date Jan 22, 2002
- International Business Machines Corporation
- Eric A. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polytetrafluoroethylene thin film chip carrier
- Patent number 6,259,037
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Natalie Barbara Feilchenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tented plated through-holes and method for fabrication thereof
- Patent number 6,249,045
- Issue date Jun 19, 2001
- International Business Machines Corporation
- John S. Kresge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate for electronic components
- Patent number 6,228,470
- Issue date May 8, 2001
- International Business Machines Corporation
- John S. Kresge
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of forming a via in a substrate
- Patent number 6,203,652
- Issue date Mar 20, 2001
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of filling an aperture in a substrate
- Patent number 6,114,098
- Issue date Sep 5, 2000
- International Business Machines Corporation
- Bernd Karl Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
- Publication number 20110284273
- Publication date Nov 24, 2011
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making circuitized substrates having film resistors as pa...
- Publication number 20090178271
- Publication date Jul 16, 2009
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making a circuitized substrate with enhanced circuitry an...
- Publication number 20080098595
- Publication date May 1, 2008
- Endicott Interconnect Technologies, Inc.
- John S. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate, method of making same and information handli...
- Publication number 20060046462
- Publication date Mar 2, 2006
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate, method of making same and information handli...
- Publication number 20060040426
- Publication date Feb 23, 2006
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Material separation to form segmented product
- Publication number 20050224167
- Publication date Oct 13, 2005
- Endicott Interconnect Technologies, Inc.
- Timothy E. Antesberger
- B31 - MAKING ARTICLES OF PAPER OR CARDBOARD WORKING PAPER OR CARDBOARD
Information Patent Application
Circuitized substrate, method of making same and information handli...
- Publication number 20050074924
- Publication date Apr 7, 2005
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Material separation to form segmented product
- Publication number 20040201136
- Publication date Oct 14, 2004
- Endicott Interconnect Technologies, Inc.
- Timothy E. Antesberger
- B31 - MAKING ARTICLES OF PAPER OR CARDBOARD WORKING PAPER OR CARDBOARD
Information Patent Application
Integrated circuit structure
- Publication number 20040099939
- Publication date May 27, 2004
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Economical high density chip carrier
- Publication number 20040099960
- Publication date May 27, 2004
- Sylvia Adae-Amoakoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Strain relief for substrates having a low coefficient of thermal ex...
- Publication number 20030101581
- Publication date Jun 5, 2003
- John S. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board construction
- Publication number 20020166697
- Publication date Nov 14, 2002
- International Business Machines Corporation
- Mark L. Janecek
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method and structure for economical high density chip carrier
- Publication number 20020145203
- Publication date Oct 10, 2002
- International Business Machines Corporation
- Sylvia Adae-Amoakoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BEAM SYSTEM FOR MICRO VIA FORMATION
- Publication number 20020125221
- Publication date Sep 12, 2002
- International Business Machines Corporation
- John S. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser ablatable material and its use
- Publication number 20020094491
- Publication date Jul 18, 2002
- International Business Machines Corporation
- John S. Kresge
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Electronic package with high density interconnect layer
- Publication number 20020085364
- Publication date Jul 4, 2002
- Francis J. Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package for electronic components and method of making same
- Publication number 20020059723
- Publication date May 23, 2002
- John S. Kresge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of a metallic interlocking structure
- Publication number 20020056890
- Publication date May 16, 2002
- International Business Machines Corporation
- Gerald G. Advocate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tented plated through-holes and method for fabrication thereof
- Publication number 20010022392
- Publication date Sep 20, 2001
- International Business Machines Corporation
- John S. Kresge
- H01 - BASIC ELECTRIC ELEMENTS

John S. Kresge

Person

Patents Grantslast 30 patents

Method of making circuitized substrates having film resistors as pa...

Power core for use in circuitized substrate and method of making same

Method of making a circuitized substrate with enhanced circuitry an...

Method of making circuitized substrate

Method of making circuitized substrate

Method of making circuitized substrate

Method of making an electronic package

Economical high density chip carrier

Material separation to form segmented product

Integrated circuit structure

Method for forming an electrical structure

Method of making a multi-layered interconnect structure

Economical high density chip carrier

Integrated circuit structure

Formation of a metallic interlocking structure

Laser ablatable material and its use

Tented plated through-holes and method for fabrication thereof

Strain relief for substrates having a low coefficient of thermal ex...

Laser excision of laminate chip carriers

Laser beam system for micro via formation

Electronic package with high density interconnect layer

Laser ablatable material and its use

Electronic package for electronic components and method of making same

Metallic interlocking structure

Stress relieved ball grid array package

Polytetrafluoroethylene thin film chip carrier

Tented plated through-holes and method for fabrication thereof

Composite substrate for electronic components

Method of forming a via in a substrate

Method of filling an aperture in a substrate

Patents Applicationslast 30 patents

POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME

Method of making circuitized substrates having film resistors as pa...

Method of making a circuitized substrate with enhanced circuitry an...

Circuitized substrate, method of making same and information handli...

Circuitized substrate, method of making same and information handli...

Material separation to form segmented product

Circuitized substrate, method of making same and information handli...

Material separation to form segmented product

Integrated circuit structure

Economical high density chip carrier

Strain relief for substrates having a low coefficient of thermal ex...

Circuit board construction

Method and structure for economical high density chip carrier

LASER BEAM SYSTEM FOR MICRO VIA FORMATION

Laser ablatable material and its use

Electronic package with high density interconnect layer

Electronic package for electronic components and method of making same

Formation of a metallic interlocking structure

Tented plated through-holes and method for fabrication thereof