John T. Gasner

Person

Melbourne, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Devices including bond pad having protective sidewall seal
- Patent number 8,963,266
- Issue date Feb 24, 2015
- Intersil Americas LLC
- Helen Hongwei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 8,946,912
- Issue date Feb 3, 2015
- Intersil Americas LLC
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 8,652,960
- Issue date Feb 18, 2014
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 8,569,896
- Issue date Oct 29, 2013
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protecting bond pad for subsequent processing
- Patent number 8,536,044
- Issue date Sep 17, 2013
- Intersil Americas Inc.
- Helen Hongwei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated process for thin film resistors with silicides
- Patent number 8,338,914
- Issue date Dec 25, 2012
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 8,274,160
- Issue date Sep 25, 2012
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 7,795,130
- Issue date Sep 14, 2010
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated process for thin film resistors with silicides
- Patent number 7,662,692
- Issue date Feb 16, 2010
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated process for thin film resistors with silicides
- Patent number 7,341,958
- Issue date Mar 11, 2008
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 7,224,074
- Issue date May 29, 2007
- Intersil Americas Inc.
- John T Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active area bonding compatible high current structures
- Patent number 7,005,369
- Issue date Feb 28, 2006
- Intersil American Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS integrated circuit architecture incorporating deep implanted e...
- Patent number 6,350,640
- Issue date Feb 26, 2002
- Intersil Americas Inc.
- Robert T. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-uniformly nitrided gate oxide and method
- Patent number 5,808,348
- Issue date Sep 15, 1998
- Harris Corporation
- Akira Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and method for improving room-temperature testability o...
- Patent number 5,696,452
- Issue date Dec 9, 1997
- Harris Corporation
- Donald F. Hemmenway
- G01 - MEASURING TESTING
Information Patent Grant
Method of making non-uniformly nitrided gate oxide
- Patent number 5,650,344
- Issue date Jul 22, 1997
- Harris Corporation
- Akira Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable element in barrier metal device
- Patent number 5,648,678
- Issue date Jul 15, 1997
- Harris Corporation
- Patrick A. Begley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct etch for thin film resistor using a hard mask
- Patent number 5,547,896
- Issue date Aug 20, 1996
- Harris Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Analog-to-digital converter
- Patent number 5,481,129
- Issue date Jan 2, 1996
- Harris Corporation
- Glenn A. DeJong
- G05 - CONTROLLING REGULATING
Information Patent Grant
ESD protection transistors
- Patent number 4,760,433
- Issue date Jul 26, 1988
- Harris Corporation
- W. Ronald Young
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Via metallization using metal fillets
- Patent number 4,666,737
- Issue date May 19, 1987
- Harris Corporation
- George E. Gimpelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of making twin well VLSI CMOS
- Patent number 4,599,789
- Issue date Jul 15, 1986
- Harris Corporation
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implant mask reversal process
- Patent number 4,578,859
- Issue date Apr 1, 1986
- Harris Corporation
- Frederick N. Hause
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage CMOS with local oxidation for self-aligned guard rings...
- Patent number 4,223,334
- Issue date Sep 16, 1980
- Harris Corporation
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating high voltage CMOS with self-aligned guard r...
- Patent number 4,135,955
- Issue date Jan 23, 1979
- Harris Corporation
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20140113444
- Publication date Apr 24, 2014
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20130130445
- Publication date May 23, 2013
- INTERSIL AMERICAS INC.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20120261836
- Publication date Oct 18, 2012
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING BOND PAD HAVING PROTECTIVE SIDEWALL SEAL
- Publication number 20120241893
- Publication date Sep 27, 2012
- Intersil Americas Inc.
- Helen Hongwei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTING BOND PAD FOR SUBSEQUENT PROCESSING
- Publication number 20120007199
- Publication date Jan 12, 2012
- Intersil Americas Inc.
- Helen Hongwei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20100261344
- Publication date Oct 14, 2010
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PROCESS FOR THIN FILM RESISTORS WITH SILICIDES
- Publication number 20100117198
- Publication date May 13, 2010
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PROCESS FOR THIN FILM RESISTORS WITH SILICIDES
- Publication number 20080026536
- Publication date Jan 31, 2008
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20070187837
- Publication date Aug 16, 2007
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
- Publication number 20070184645
- Publication date Aug 9, 2007
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated process for thin film resistors with silicides
- Publication number 20060166505
- Publication date Jul 27, 2006
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active area bonding compatible high current structures
- Publication number 20060099823
- Publication date May 11, 2006
- Intersil Americas Inc.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active area bonding compatible high current structures
- Publication number 20050042853
- Publication date Feb 24, 2005
- INTERSIL AMERICAS INC.
- John T. Gasner
- H01 - BASIC ELECTRIC ELEMENTS

John T. Gasner

Person

Patents Grantslast 30 patents

Devices including bond pad having protective sidewall seal

Active area bonding compatible high current structures

Active area bonding compatible high current structures

Active area bonding compatible high current structures

Protecting bond pad for subsequent processing

Integrated process for thin film resistors with silicides

Active area bonding compatible high current structures

Active area bonding compatible high current structures

Integrated process for thin film resistors with silicides

Integrated process for thin film resistors with silicides

Active area bonding compatible high current structures

Active area bonding compatible high current structures

CMOS integrated circuit architecture incorporating deep implanted e...

Non-uniformly nitrided gate oxide and method

Arrangement and method for improving room-temperature testability o...

Method of making non-uniformly nitrided gate oxide

Programmable element in barrier metal device

Direct etch for thin film resistor using a hard mask

Analog-to-digital converter

ESD protection transistors

Via metallization using metal fillets

Process of making twin well VLSI CMOS

Implant mask reversal process

High voltage CMOS with local oxidation for self-aligned guard rings...

Process for fabricating high voltage CMOS with self-aligned guard r...

Patents Applicationslast 30 patents

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

DEVICES INCLUDING BOND PAD HAVING PROTECTIVE SIDEWALL SEAL

PROTECTING BOND PAD FOR SUBSEQUENT PROCESSING

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

INTEGRATED PROCESS FOR THIN FILM RESISTORS WITH SILICIDES

INTEGRATED PROCESS FOR THIN FILM RESISTORS WITH SILICIDES

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

Integrated process for thin film resistors with silicides

Active area bonding compatible high current structures

Active area bonding compatible high current structures